Uttam S Ghoshal, Harry Kroger: Superconductor-semiconductor hybrid memory circuits with superconducting three-terminal switching devices. Microelectronics & Computer Technology, Fulbright & Jaworski, February 7, 1995: US05388068 (143 worldwide citation)

Superconducting-semiconducting hybrid memories are disclosed. These superconducting-semiconducting hybrid memories utilize semiconductor circuits to store information, and either superconducting or semiconducting or combinations of superconducting and semiconducting circuits, with at least some supe ...

David H Carey: Flip substrate for chip mount. Microelectronics & Computer Technology Corporation, Fulbright & Jaworski, August 13, 1991: US05039628 (60 worldwide citation)

A substrate for attaching electrical devices having an interconnect wiring structure and a support for the interconnect, the support having a number of vias, or throughholes, extending therethrough and electrically connected to the interconnect. The substrate allows for attachment of the electrical ...

Carl Pixley: Apparatus and method for determining sequential hardware equivalence. Microelectronics & Computer Technology Corporation, Ross Howison Clapp & Korn, July 19, 1994: US05331568 (37 worldwide citation)

A method for determining sequential hardware equivalence between two designs and whether one design can replace another design is disclosed whereby the designs are compared utilizing OBDD representations of the designs. The set of states in each of the designs that are equivalent to each other, equi ...

Heinrich G O Muller: Solution for direct copper writing. Microelectronics Computer & Technology, Fulbright & Jaworski, January 5, 1993: US05176744 (32 worldwide citation)

Improved method and solutions for copper direct writing, particularly laser-induced direct writing, involving copper formate precursor solutions that contain a crystallization-inhibiting agent. The agent is selected from glycerol, citric acid, malic acid, malonic acid and glycine.

William J Leddy: Computer scalable visualization system. Microelectronics & Computer Technology Corporation, Ross Howison Clapp & Korn, June 14, 1994: US05321505 (27 worldwide citation)

A scalable visualization system includes a plurality of scalable tiles (10) that each comprise a display portion (18) and a processing portion (20). Each of the display portions (18) define a portion of a physical display space. Each of the processing sections defines a processing node in the parall ...

Ian Y K Yee: Titanium-tungsten etching solutions. Microelectronics Computer & Technology, Fulbright & Jaworski, May 18, 1993: US05211807 (20 worldwide citation)

Etchant solutions for titanium-tungsten, which include at least one oxidizing agent and at least one fluoride salt. Also disclosed is a method for etching TiW utilizing these etchants.

Eric J Hartman: Neural-network content-addressable memory. Microelectronics & Computer Technology, Fulbright & Jaworski, October 12, 1993: US05253328 (18 worldwide citation)

A neural network content-addressable error-correcting memory system is disclosed including a plurality of hidden and visible processing units interconnected via a linear interconnection matrix. The network is symmetric and all self-connections are not present. All connections between processing unit ...

Harry Kroger, Uttam S Ghoshal: Superconducting-semiconducting circuits, devices and systems. Microelectronics & Computer Technology Corporation, Fulbright & Jaworski, June 18, 1991: US05024993 (14 worldwide citation)

A hybrid superconducting-semiconducting field effect transistor-like circuit element comprised of a superconducting field effect transistor and a closely associated cryogenic semiconductor inverter for providing signal gain is described. The hybrid circuit functions as a nearly ideal pass gate in cr ...

Nalin Kumar, Chenggang Xie: Diamond film flat field emission cathode. Microelectronics & Computer Technology, Kelly K Winstead Sechrest & Minick P C Kordzik, December 30, 1997: US05703435 (13 worldwide citation)

A field emission cathode for use in flat panel displays is disclosed comprising a layer of conductive material and a layer of amorphic diamond film, functioning as a low effective work-function material, deposited over the conductive material to form emission sites. The emission sites each contain a ...

Hsyh Min Hsu, Ian Y K Yee: Spray pyrolysis process for preparing superconductive films. Microelectronics & Computer Technology, Fulbright & Jaworski, June 4, 1991: US05021399 (12 worldwide citation)

An improved method for preparing high temperature Bi-Sr-Ca-Cu-O superconductive films utilizing spray pyrolysis. The method can further include an additional annealing step to improve the electrical transport properties.