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Impey John: Injection molded multi-layer circuit board and method of making same. Impey John, Mettler Rollin W Jr, Mettler John H, DeLIO Anthony P, April 24, 1986: WO/1986/002518

A multi-layer circuit board comprised of two or more circuit board substrates (10, 12) shaped by injection molding with mating interconnecting pins (22) and holes (24) and banded together with an electrically insulated adhesive material (28). Circuit leads (14, 16, 18, 20) are provided on both sides ...