1
Herbert Stanley Cole Jr, Theresa Ann Sitnik Nieters: Method for making an electronic module. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, May 5, 1998: US05745984 (342 worldwide citation)

A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to ...


2
Raymond A Fillion, Robert J Woinarowski, Michael Gdula, Herbert S Cole, Eric J Wildi, Wolfgang Daum: Embedded substrate for integrated circuit modules. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, March 5, 1996: US05497033 (311 worldwide citation)

Substrate material is molded directly to semiconductor chips and other electrical components that are positioned for integrated circuit module fabrication. Chips having contact pads are placed face down on a layer of adhesive supported by a base. A mold form is positioned around the chips. Substrate ...


3
Maher E Tadros, James A Mason, Christopher A Kadoch: Oxide coated metal grid electrode structure in display devices. Martin Marietta Corporation, Gay Chin, Bruce M Winchell, Alan G Towner, March 8, 1994: US05293546 (286 worldwide citation)

An improved working electrode for use in display devices is disclosed. The working electrode comprises a transparent metal grid having a coating of metal oxide thereon. Suitable metal grids include Cu, Au, Ag, Al, Pt, Ni and Zn, while suitable metal oxide coatings include In.sub.2 O.sub.3, SnO.sub.2 ...


4
Herbert S Cole, Raymond A Fillion, Bernard Gorowitz, Ronald F Kolc, Robert J Wojnarowski: Fabrication and structures of circuit modules with flexible interconnect layers. Martin Marietta Corporation, Geoffrey H Krauss, June 18, 1996: US05527741 (187 worldwide citation)

A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having c ...


5
Wlodzimierz Holsztynski: Geometric-arithmetic parallel processor. Martin Marietta Corporation, Burns Doane Swecker & Mathis, April 19, 1988: US04739474 (161 worldwide citation)

A plurality of identical processor cells arranged interconnected to form a data processor for processing digital data signals.


6
Wells Joel D, McClure George F, Freeman Lionel D, Endicott John R, Cunningham Marion L: Multiple zone communications system and method. Martin Marietta Corporation, Burns Doane Swecker Mathis, August 5, 1975: US3898390 (143 worldwide citation)

A method and system for more efficiently utilizing presently available and prospectively available two-way communication channels for communication between mobile telephones and either fixed telephones or mobile telephones. A large mobile telephone service area is divided into a plurality of smaller ...


7
Herbert S Cole Jr, Theresa A Sitnik Nieters, Robert J Wojnarowski, John H Lupinski: Reworkable high density interconnect structure incorporating a release layer. Martin Marietta Corporation, Brian J Rees, Geoffrey H Krauss, July 18, 1995: US05434751 (138 worldwide citation)

A multichip module (incorporating a high density interconnect structure) has: a first portion containing a substrate with semiconductor chips therein, with each chip having contact pads; a second portion comprising a (HDI) structure interconnecting the chip pads; and a solvent-soluble release layer ...


8
William J Owen, Robert A Booker: Optimum second order digital filter. Martin Marietta Corporation, Sughrue Mion Zinn Macpeak & Seas, October 26, 1982: US04356558 (131 worldwide citation)

A second order digital filter utilizing six processor operations, two add instructions, two shift instructions and two store instructions. No multipliers are required. The filter is used as a digital filter in a servo loop having a Z transform of, G(Z)=4 (1-Z.sup.-1)+Z.sup.-2.


9
Harry C Ast, Albert H Berical, Blake A Carnahan, James W Krueger Jr, Donald P Miller, John D Reale: Self monitoring/calibrating phased array radar and an interchangeable, adjustable transmit/receive sub-assembly. Martin Marietta Corporation, Paul Checkovich, Stephen A Young, May 2, 1995: US05412414 (124 worldwide citation)

The invention relates to a self monitoring/calibrating phased array radar in which the operating path for transmission and the operating path for reception may be monitored/calibrated by the addition of a corporate calibration network coupled at the plural end to the antenna elements and at the sing ...


10
Bernadette G Reiter, John W Castor, R J Carter Blume, Roy A Schewe, Leonard D Shepley: Associative data access method (ADAM) and its means of implementation. Martin Marietta Corporation, Gay Chin, James B Eisel, August 5, 1986: US04604686 (122 worldwide citation)

An input/output driver program residing in digital computer apparatus responsive to Pascal type of software and which operates to emulate an asychronous terminal, as opposed to bisynchronous devices having defined protocols, in a distributed processing environment. The computer thus programmed is ad ...