1
Hideaki Okabe, Eiji Suzuki, Masao Kogure, Takanori Saito: Gel pharmaceutical formulation for local anesthesia. Lintec Corporation, Millen White Zelano & Branigan P C, December 31, 1996: US05589192 (80 worldwide citation)

An article of manufacture in the form of a gel pharmaceutical formulation for local anesthesia is prepared by a process comprising: coating a supporting substrate, which preferably is porous, e.g., a non-woven fabric, and has an impervious backing sheet, with a matrix of a copolymer of alkyl (meth)a ...


2
Norito Umehara, Masazumi Amagai, Mamoru Kobayashi, Kazuyoshi Ebe: Process for producing semiconductor device. Texas Instruments Japan, Lintec Corporation, Webb Ziesenheim Bruening Logsdon Orkin & Hanson P C, March 16, 1999: US05882956 (70 worldwide citation)

A process for manufacturing a wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive ...


3
Mikio Komiyama, Yasunao Miyazawa, Kazuyoshi Ebe, Takanori Saito: Method of dicing and bonding semiconductor chips using a photocurable and heat curable adhesive tape. Lintec Corporation, Wenderoth Lind & Ponack, May 5, 1992: US05110388 (67 worldwide citation)

An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight co ...


4
Hirofumi Ono: Liquid vaporizer/feeder. Lintec, Edwin E Greigg, Ronald E Greigg, December 13, 1994: US05372754 (67 worldwide citation)

In a liquid vaporizing/feeding method of the present invention, carrier gas is forced out at a very high speed against a mass flow controlled liquid feedstock to change the liquid feedstock into a mist; after that, the mist of the feedstock is vaporized and mixed with the carrier gas, and a mixture ...


5
Takuya Okuda, Toshio Sugizaki, Masao Kogure, Takanori Saitoh: Vibration damper material comprising a vicso elastic layer of unvulcanized rubber. Lintec Corporation, G Peter Nichols, Brinks Hofer Gilson & Lione, January 12, 1999: US05858521 (62 worldwide citation)

The vibration damper material comprises a laminate of a viscoelastic layer and a hardenable pressure sensitive adhesive layer, and a release liner applied onto the hardenable pressure sensitive adhesive layer. The viscoelastic layer is intended to form a vibration damping layer, and contains a visco ...


6
Mikio Komiyama, Yasunao Miyazawa, Kazuyoshi Ebe, Takanori Saito: Adhesive tape and use thereof. Lintec Corporation, Wenderoth Lind & Ponack, June 2, 1992: US05118567 (49 worldwide citation)

An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight co ...


7
Hideo Senoo, Yoshihisa Mineura: Method of using a transfer tape. Lintec Corporation, Webb Ziesenheim Logsdon Orkin & Hanson P C, April 8, 2003: US06544371 (48 worldwide citation)

A method of securing semiconductor chips comprises the steps of: sticking semiconductor chips at their backs to a transfer tape having an adhesive superimposed thereon at spaced intervals; peeling the semiconductor chips from the transfer tape such that the adhesive is transferred onto the backs of ...


8
Hideo Senoo, Takasi Sugino: Method of preventing transfer of adhesive substance to dicing ring frame, pressure-sensitive adhesive sheet for use in the method and wafer working sheet having the pressure-sensitive adhesive sheet. Lintec Corporation, Webb Ziesenheim Bruening Logsdon Orkin & Hanson P C, January 6, 1998: US05705016 (46 worldwide citation)

The present invention disposes an easily releasing layer on a surface intended for dicing tape sticking of a dicing ring frame to thereby enable preventing the transfer of an adhesive substance to the ring frame for use in semiconductor wafer working, reducing the frequency of cleaning of the ring f ...


9
Hayato Noguchi, Yoshihisa Mineura, Kazuyoshi Ebe: Method of using pressure sensitive adhesive double coated sheet. Lintec Corporation, Webb Ziesenheim Logsdon Orkin & Hanson P C, June 4, 2002: US06398892 (40 worldwide citation)

Disclosed herein is a pressure sensitive adhesive double coated sheet comprising a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of the pressure sensitive adhesive layers being composed of an energy radiation curable pressure sensitive adh ...


10
Mikio Komiyama, Yasunao Miyazawa, Kazuyoshi Ebe, Takanori Saito: Adhesive composition comprising (meth)acrylate polymer and epoxy resin. Lintec Corporation, Wenderoth Lind & Ponack, October 18, 1994: US05356949 (39 worldwide citation)

An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight co ...



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