1
Byeong Duck Lee: Semiconductor chip package having clip-type outlead and fabrication method of same. LG Semicon, Fleshner & Kim, October 13, 1998: US05821615 (205 worldwide citation)

A semiconductor chip package having a clip type lead frame and fabrication thereof. The package includes a semiconductor chip having a plurality of bond pads thereon, a first package body having a recess, a plurality of inner leads each connected electrically to a corresponding one of the bond pads, ...


2
Chi Jung Song, Ju Hwa Lee: Integrated chip package with reduced dimensions and leads exposed from the top and bottom of the package. LG Semicon, Fleshner & Kim, June 23, 1998: US05770888 (200 worldwide citation)

An improved package is thinner with increased memory capacity and improved heat emission effect. The package includes a plurality of leads, where each lead comprises a first connection lead and a second connection lead with upper and lower surfaces. An integrated chip, such as a semiconductor chip, ...


3
Deog Soo Son: Semiconductor package and lead frame. LG Semicon, July 21, 1998: US05783861 (174 worldwide citation)

A semiconductor package comprises at least one semiconductor chip; a lead frame having a chip paddle supporting a semiconductor chip, a plurality of inner leads wire-bonded to the chip and a plurality of outer lead extended from the inner leads; and a plastic molding compound sealing the chip and th ...


4
Jae Weon Cho: LOC (lead on chip) package and fabricating method thereof. LG Semicon, Fleshner & Kim, November 10, 1998: US05834830 (166 worldwide citation)

An LOC semiconductor package includes: a semiconductor chip; a plurality of two-sided tapes being attached on predetermined portions of the semiconductor chip inthe form of layers; a lead frame having a step coverage corresponding to the form of the two-sided tape; wires electrically connecting inne ...


5
Sihn Choi: Transfer molding apparatus having laminated chase block. LG Semicon, Fleshner & Kim, February 16, 1999: US05871782 (158 worldwide citation)

An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality ...


6
Heung Sup Chun: Bottom lead semiconductor chip package. LG Semicon, Fleshner & Kim, March 28, 2000: US06043430 (157 worldwide citation)

A bottom lead package is capable of increasing a memory capacity for a mounting position on a mother board by stacking several semiconductor packages such that exposed surfaces of leads on upper and lower surfaces of the package are aligned. The package includes a semiconductor chip, a plurality of ...


7
Yong Chan Kim: Bottom lead semiconductor chip stack package. LG Semicon, August 17, 1999: US05939779 (125 worldwide citation)

A bottom lead semiconductor chip stack package which includes a first body and a second body. The first body includes a pair of lead frames, each lead frame having a first lead portion and a second lead portion. A protrusion enclosed in a solder extends from the first lead portion. The first body al ...


8
Kwang Bok Song, Sung Ki Kim, Jin Sub Shim: Method of fabricating solid state image sensing elements. LG Semicon, Morgan Lewis and Bockius, September 30, 1997: US05672519 (124 worldwide citation)

This invention relates to microlenses of the solid state image sensing element and the method for fabricating the microlenses of the solid image sensing elements, which provides a solid state image sensing element including a substrate, photo diode areas each having a plurality of photo diodes in ma ...


9
Suk Bin Han: Wafer wet treating apparatus. LG Semicon, Morgan Lewis & Bockius, November 24, 1998: US05839456 (124 worldwide citation)

A wafer wet treatment apparatus includes a first supply/discharge line, an outer bath connected to the first supply/discharge line, an inner bath within the outer bath, a second supply/discharge line connected to the inner bath, and at least one partition located on a portion of the inner bath.


10
Dong You Kim: Bottom lead frame and bottom lead semiconductor package using the same. LG Semicon, Fleshner & Kim, September 12, 2000: US06118174 (111 worldwide citation)

A bottom lead frame and a bottom lead semiconductor package embodying the invention are capable of forming a multiple row pin structure. The bottom lead frame includes a plurality of first leads, and a plurality of second leads, where each lead has a bottom lead portion and an inner lead portion tha ...