Hemker David, Redeker Fred C, Boyd John, de, Larios John M, Ravkin Michael, Korolik Mikhail: Apparatus and method for providing a confined liquid for immersion lithography. Lam Research Corporation, Hemker David, Redeker Fred C, Boyd John, de, Larios John M, Ravkin Michael, Korolik Mikhail, MIZUMOTO Edmund H, January 13, 2005: WO/2005/003864 (397 worldwide citation)

A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.

John S Ogle: Method and apparatus for producing magnetically-coupled planar plasma. LAM Research Corporation, Townsend and Townsend, August 14, 1990: US04948458 (379 worldwide citation)

An apparatus for producing a planar plasma in a low pressure process gas includes a chamber and an external planar coil. Radiofrequency resonant current is induced in the planar coil which in turn produces a planar magnetic field within the exclosure. The magnetic field causes circulating flux of el ...

Ching Hwa Chen, David Arnett, David Liu: Plasma cleaning method for removing residues in a plasma treatment chamber. LAM Research Corporation, Burns Doane Swecker & Mathis, October 18, 1994: US05356478 (227 worldwide citation)

A plasma cleaning method for removing residues previously formed in a plasma treatment chamber by dry etching layers such as photoresist, barriers, etc., on a wafer. The method includes introducing a cleaning gas mixture of an oxidizing gas and a chlorine containing gas into the chamber followed by ...

Raymond L Degner, Eric H Lenz: Composite electrode for plasma processes. LAM Research Corporation, Townsend and Townsend, December 24, 1991: US05074456 (201 worldwide citation)

An electrode assembly for a plasma reactor, such as a plasma etch or plasma-enhanced chemical vapor deposition reactor, comprises an electrode plate having a support frame attached to one surface thereof. The electrode plate is composed of a substantially pure material which is compatible with a par ...

Neil Benjamin, Jon Hylbert, Stefano Mangano: Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support. Lam Research Corporation, Burns Doane Swecker & Mathis, October 13, 1998: US05820723 (197 worldwide citation)

A vacuum processing chamber having a substrate support removably mounted therein. The chamber includes an opening in a sidewall thereof and the opening is large enough to allow the substrate support to be removed from the chamber through the opening. A modular mounting arrangement extends through th ...

Roger Patrick, Norman Williams: Methods and apparatus for controlling ion energy and plasma density in a plasma processing system. Lam Research Corporation, January 16, 2001: US06174450 (172 worldwide citation)

A plasma processing system includes a plasma reactor, a first power circuit, a second power circuit and a feedback circuit. The first power circuit supplies a first radio frequency (rf) energy to the plasma reactor that is suitable for creating a direct current bias on a workpiece positioned within ...

David R Pirkle: Methods for filling trenches in a semiconductor wafer. Lam Research Corporation, Beyer & Weaver, June 22, 1999: US05915190 (169 worldwide citation)

A method for filling a trench in a semiconductor wafer that is disposed in a plasma-enhanced chemical vapor deposition chamber. The method includes the step of depositing a protection layer of silicon dioxide over the wafer and into the trench while the wafer is biased at a first RF bias level. The ...

George R Koch: Adjustable electrode plasma processing chamber. Lam Research Corporation, Thomas E Schatzel, July 20, 1982: US04340462 (162 worldwide citation)

A plasma processing chamber incorporating parallel plate electrodes whose separation may be mechanically adjusted from the outside thereof. The chamber includes a sealable assembly including an electrode housing and a reaction chamber body. The body includes an aperture to receive a planar surfaced ...

Jian Janson Chen, William S Kennedy: Temperature sensing system for use in a radio frequency environment. Lam Research Corporation, Beyer Weaver Thomas & Nguyen, May 16, 2000: US06063234 (161 worldwide citation)

The invention relates to a temperature sensing system that accurately measures temperatures of articles or areas using a contact sensor even in a high radio frequency environment. The temperature sensing system includes a sensor probe that contacts with an article or area that is to have its tempera ...

Rajinder Dhindsa, Fangli Hao, Eric Lenz: Gas distribution apparatus for semiconductor processing. Lam Research Corporation, Burns Doane Swecker & Mathis, August 13, 2002: US06432831 (156 worldwide citation)

A gas distribution system for uniformly or non-uniformly distributing gas across the surface of a semiconductor substrate. The gas distribution system includes a support plate and a showerhead which are secured together to define a gas distribution chamber therebetween. A baffle assembly including o ...