David Sherrer
David W Sherrer: Microstructures comprising silicon nitride layer and thin conductive polysilicon layer. Shipley Company L L C, Niels Haun, Jonathan D Baskin, March 2, 2004: US06698295 (96 worldwide citation)

Surface micromachined structures having a relatively thick silicon nitride layer and a relatively thin conductive polysilicon layer bonded together. Preferably, the silicon nitride layer and conductive polysilicon layer are made in the same low pressure chemical vapor deposition (LPCVD) step. The po ...

Charles Szmanda
Gary N Taylor, Charles R Szmanda: Polymers and photoresist compositions. Shipley Company L L C, Darryl P Frickey, Peter F Corless, May 2, 2000: US06057083 (41 worldwide citation)

The present invention provides novel polymers and chemically-amplified positive-acting photoresist compositions that contain such polymers as a resin binder component. Preferred polymers of the invention include one or more structural groups that are capable of reducing the temperature required for ...

David Sherrer
David W Sherrer, Noel Heiks, Dan Steinberg: Inductive magnetic recording head having inclined magnetic read/write pole and method of making same. Shipley Company L L C, Brown Rudnick Berlack Israels, December 31, 2002: US06501619 (31 worldwide citation)

A thin film magnetic read/write head which has a return pole and a read/write pole adjacent to the return pole. The return pole has a vertical sidewall which has a predetermined height and is perpendicular to a substrate. An insulating layer is disposed on the sidewall between the return pole and re ...

David Sherrer
Dan A Steinberg, David W Sherrer, Mindaugas F Daurtartas, Robert G Schinazi: Fiber array with V-groove chip and mount. Shipley Company L L C, Johnthan D Baskin, November 16, 2004: US06819858 (29 worldwide citation)

A molded mount of non-crystalline polymer material is configured to have a channel for retaining a silicon chip having a plurality of juxtaposed V-groove formed in a top surface between right and left side portions, thereof, a recessed area being provided in the channel behind the chip for accommoda ...


David Sherrer
David W Sherrer, Gregory A TenEyck: Single mask lithographic process for patterning multiple types of surface features. Shipley Company L L C, Jonathan D Baskin, November 2, 2004: US06811853 (21 worldwide citation)

A method for patterning different types of surface features on a semiconductor substrate (e.g. metal pads, etched pits and grooves) where the features are accurately located by a single mask. First, a dielectric layer is formed on the substrate. Next, an etch-resistant metal layer is formed on the d ...

Charles Szmanda
Charles R Szmanda, George G Barclay, Peter Trefonas III, Wang Yueh: Polymer and photoresist compositions. Shipley Company L L C, S Matthew Cairns, June 18, 2002: US06406828 (19 worldwide citation)

Disclosed are polymers including as polymerized units one or more spirocyclic olefin monomer of the formulae I or Ia

Garo Khanarian
Garo Khanarian, Yujian You, Robert H Gore, Angelo A Lamola: Porous optical materials. Shipley Company L L C, S Matthew Cairns, November 22, 2005: US06967222 (17 worldwide citation)

Methods of preparing porous optical materials are provided. These methods allow for the selection of the desired pore size and level of porosity in the porous optical material. Such methods utilize a preformed polymeric porogen.

David Sherrer
David W Sherrer, Gregory A Ten Eyck, Dan A Steinberg, Neal Ricks: Single mask technique for making positive and negative micromachined features on a substrate. Shipley Company L L C, Jonathan D Baskin, September 30, 2003: US06627096 (17 worldwide citation)

Methods for making a micromachined device (e.g. an microoptical submount) having positive features (extending up from a device surface) and negative features (extending into the device surface). The present techniques locate the postive feature and negative features according to a single mask step. ...

Charles Szmanda
Charles R Szmanda, Anthony Zampini: Solvents and photoresist compositions for short wavelength imaging. Shipley Company L L C, Peter F Corless, Darryl P Frickey, Edwards & Angell, September 7, 2004: US06787286 (16 worldwide citation)

New photoresists are provides that are suitable for short wavelength imaging, particularly sub-170 nm such as 157 nm. Resists of the invention comprise a fluorine-containing polymer, a photoactive component, and a solvent component. Preferred solvents for use on the resists of the invention can main ...