1
Paul Garland, James Kyo Long, Yozo Satoda, Chong il Park: High frequency microwave packaging having a dielectric gap. Kyocera America, Hogan & Hartson L, March 20, 2001: US06204448 (64 worldwide citation)

A hermetically sealed package assembly for microwave circuits in the high microwave frequencies having a dielectric gap defined in the substrate. The package assembly comprises a substrate for carrying the circuit on a top surface, a seal ring wall carried on the top surface, a via structure provide ...


2
Frank J Gaughan, Aki Nomura, Kiyoshi Hatakeyama, John Washington McCoy, Yoichi Hamano: Ceramic multilayer helical antenna for portable radio or microwave communication apparatus. Kyocera America, Loeb & Loeb, April 4, 2000: US06046707 (39 worldwide citation)

A small and durable antenna for use with radio and microwave communications is formed as a helical conductor contained in a multilayered non-ferrite ceramic chip. The dielectric constant of the ceramic is selected to match the antenna to its operating frequency, which may be in the range of 0.5 to 1 ...


3
John Washington McCoy: Semiconductor substrate having copper/diamond composite material and method of making same. Kyocera America, Hogan & Hartson, April 27, 2004: US06727117 (28 worldwide citation)

A semiconductor package for power transistors of the LDMOS type has a metallic substrate with a die mounted directly thereon, lead frame insulators mounted thereon adjacent the die and a plurality of leads mounted on the insulators and electrically coupled to the die by bond wires. The substrate inc ...


4
Henry Beppu, Toshi Kushuhara, Aki Nomura: Ceramic-glass integrated circuit package with ground plane. Kyocera America, Spensley Horn Jubas & Lubitz, February 12, 1991: US04992628 (26 worldwide citation)

A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate and a layer of conductive material adjacent the ceramic base substrate to serve ...


5
Taka Irie, Aki Nomura: Leadless ceramic package with improved solderabilty. Kyocera America, Spensley Horn Jubas & Lubitz, May 24, 1994: US05314606 (22 worldwide citation)

A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal ex ...


6
Hiro Yonemasu, Kiyohide Shirai, Ikunosuke Kawamura: Low capacitance integrated circuit package. Kyocera America, Spensley Horn Jubas & Lubitz, June 5, 1990: US04931854 (14 worldwide citation)

An integrated circuit package utilizing low temperature sealing glass and having reduced lead capacitance. Voids in the glass material on the base substrate and the cap substrate result in the formation of glass-free cavities when the base substrate is fused to the cap substrate. A lead frame extend ...


7
Henry Beppu, Toshi Kusuhara, Aki Nomura: Ceramic glass integrated circuit package with integral ground and power planes. Kyocera America, Spensley Horn Jubas & Lubitz, November 2, 1993: US05258575 (12 worldwide citation)

A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to ser ...


8
Nobuaki Miyauchi, Hiroshi Yonemasu, Bakji Cho: Method of using a contamination shield during the manufacture of EPROM semiconductor package windows. Kyocera America, Spensley Horn Jubas & Lubitz, July 27, 1993: US05231036 (11 worldwide citation)

A protective shield is provided on the UV transparent window of a ceramic lid for a EPROM integrated circuit package so as to prevent accumulation of foreign particulate matter thereon during the manufacture of the package.


9
Henry Beppu, Toshi Kusuhara, Aki Nomura: Ceramic-glass integrated circuit package with integral ground and power planes. Kyocera America, Spensley Horn Jubas & Lubitz, July 28, 1992: US05134246 (10 worldwide citation)

A ceramic-glass integrated circuit package utilizing low temperature sealing glass and having reduced lead to lead capacitance. The inventive package includes a cap and a base. The base includes a ceramic base substrate, a first layer of conductive material adjacent the ceramic base substrate to ser ...


10
Nobuaki Miyauchi: Method for making a ceramic lid for hermetic sealing of an EPROM circuit. Kyocera America, Spensley Horn Jubas & Lubitz, August 27, 1991: US05043004 (9 worldwide citation)

An assembly structure and a method for making a ceramic lid for a hermetically sealed package for an EPROM circuit are disclosed. The assembly structure includes, in combination, a ceramic lid, a UV transparent lens, and two fixtures for supporting the lens in the lid. The two fixtures are configure ...