1
Igor Y Khandros, Thomas H DiStefano: Semiconductor chip assemblies with fan-in leads. IST Associates, Lerner David Littenberg Krumholz & Mentlik, September 15, 1992: US05148265 (560 worldwide citation)

A semiconductor chip having contacts on the periphery of its top surface is provided with an interposer overlying the central portion of the top surface. Peripheral contact leads extend inwardly from the peripheral contacts to central terminals on the interposer. The terminals on the interposer may ...


2
Igor Y Khandros, Thomas H DiStefano: Semiconductor chip assemblies having interposer and flexible lead. IST Associates, Lerner David Littenberg Krumholz & Mentlik, September 15, 1992: US05148266 (531 worldwide citation)

A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the ...