1
David E Ludwig, Christ H Saunders, Raphael R Some, John J Stuart: Stack of IC chips in lieu of single IC chip. Irvine Sensors Corporation, Thomas J Plante, December 3, 1996: US05581498 (299 worldwide citation)

An electronic package is disclosed in which a plurality of stacked "same function" IC chips are designed to be used in lieu of a single IC chip, and to fit into a host computer system, in such a way that the system is "unaware" that substitution has been made. Memory packages are of primary interest ...


2
John C Carson, Ronald J Indin, Stuart N Shanken: Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip. Irvine Sensors Corporation, Thomas J Plante, September 13, 1994: US05347428 (288 worldwide citation)

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder ...


3
John C Carson, Raphael R Some: Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack. Irvine Sensors Corporation, Thomas J Plante, July 11, 1995: US05432729 (269 worldwide citation)

An electronic module comprising a multiplicity of prestacked IC chips, such as memory chips, and an IC chip, referred to as an active substrate or active backplane, to which the stack of chips is directly secured. A multiplicity of aligned solder bumps may interconnect the stack and the substrate, p ...


4
Tiong C Go: High-density electronic modules--process and product. Irvine Sensors Corporation, Thomas J Plante, November 10, 1987: US04706166 (252 worldwide citation)

A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all t ...


5
Tiong C Go deceased, Joseph A Minahan, Stuart N Shanken: Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting. Irvine Sensors Corporation, Thomas J Plante, April 14, 1992: US05104820 (250 worldwide citation)

A process is disclosed which applies advanced concepts of Z-technology to the field of dense electronic packages. Starting with standard chip-containing silicon wafers, modification procedures are followed which create IC chips having second level metal conductors on top of passivation (which covers ...


6
Tiong C Go: High-density electronic modules - process and product. Irvine Sensors Corporation, Thomas J Plante, January 8, 1991: US04983533 (218 worldwide citation)

A high-density electronic module is disclosed, which is suitable for use as a DRAM, SRAM, ROM, logic unit, arithmetic unit, etc. It is formed by stacking integrated-circuit chips, each of which carries integrated circuitry. The chips are glued together, with their leads along one edge, so that all t ...


7
Tiong C Go: High density electronic package comprising stacked sub-modules. Irvine Sensors Corporation, Thomas J Plante, August 16, 1988: US04764846 (205 worldwide citation)

A high density electronic package is disclosed in which a stack of layer-like sub-modules have their edges secured to a stack-carrying substrate, the latter being in a plane perpendicular to the planes in which the sub-modules extend. Each sub-module has a cavity, inside which one or more IC chips a ...


8
John C Carson, Stewart A Clark: High-density electronic processing package-structure and fabrication. Irvine Sensors Corporation, Thomas J Plante, July 2, 1985: US04525921 (202 worldwide citation)

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with pas ...


9
John C Carson, Stewart A Clark: High-density electronic processing package--structure and fabrication. Irvine Sensors Corporation, Thomas J Plante, February 24, 1987: US04646128 (150 worldwide citation)

A high-density electronic package module is disclosed which comprises a stack of semiconductor chips having integrated circuitry on each chip. To permit the emplacement of thin film circuitry on the access ends, each access plane is etched to cut back the semiconductor material then covered with pas ...


10
John C Carson, Robert E DeCaro, Ying Hsu, Michael K Miyake: Stackable modules and multimodular assemblies. Irvine Sensors Corporation, Plante & Strauss, December 23, 1997: US05701233 (141 worldwide citation)

Stacked, multimodular circuit assemblies are provided which comprise stacked, resealable, modules containing electronic circuitry, each module having a plurality of electrically conductive, embedded through-vias between the upper and major surfaces thereof. The through-vias are contained within the ...