1
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Kyong Mo Bang: Stackable microelectronic package structures. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, March 25, 2014: US08680684 (53 worldwide citation)

A microelectronic assembly includes a first microelectronic package having a substrate with first and second opposed surfaces and substrate contacts thereon. The first package further includes first and second microelectronic elements, each having element contacts electrically connected with the sub ...


2
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with orthogonal windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 28, 2012: US08254155 (47 worldwide citation)

A microelectronic assembly can include first and second microelectronic packages mounted to opposed surfaces of a circuit panel. Each package can include a substrate having first, second, and third apertures extending therethrough, first, second, and third microelectronic elements each having a surf ...


3
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, January 1, 2013: US08345441 (46 worldwide citation)

A microelectronic assembly can include first and second microelectronic packages mounted to respective first and second opposed surfaces of a circuit panel. Each microelectronic package can include a substrate having first and second apertures extending between first and second surfaces thereof, fir ...


4
Belgacem Haba Belgacem (Bel) Haba
Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Ilyas Mohammed: Memory module in a package. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513817 (43 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the sub ...


5
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, March 11, 2014: US08670261 (38 worldwide citation)

A microelectronic structure has active elements defining a storage array, and address inputs for receipt of address information specifying locations within the storage array. The structure has a first surface and can have terminals exposed at the first surface. The terminals may include first termin ...


6
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436477 (36 worldwide citation)

A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element c ...


7
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization using duplicate sets of terminals for wirebond assemblies without windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, August 20, 2013: US08513813 (31 worldwide citation)

A microelectronic element having a memory storage array has a front face facing away from a substrate of a microelectronic package, and is electrically connected with the substrate through conductive structure extending above the front face. First terminals are disposed at locations within first and ...


8
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 14, 2013: US08441111 (31 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of termina ...


9
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with parallel windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, May 7, 2013: US08436457 (31 worldwide citation)

A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of termina ...


10
Belgacem Haba Belgacem (Bel) Haba
Richard Dewitt Crisp, Wael Zohni, Belgacem Haba, Frank Lambrecht: Stub minimization for multi-die wirebond assemblies with orthogonal windows. Invensas Corporation, Lerner David Littenberg Krumholz & Mentlik, October 2, 2012: US08278764 (31 worldwide citation)

A microelectronic package can include a substrate having first, second, and third apertures extending between first and second surfaces thereof, first, second, and third microelectronic elements each having a surface facing the first surface, and a plurality of terminals exposed at a central region ...