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William J Parrish, James T Woolaway: Methods and circuitry for correcting temperature-induced errors in microbolometer focal plane array. Indigo Systems Corporation, David E Steuber, Skjerven Morrill MacPherson Franklin & Friel, February 22, 2000: US06028309 (56 worldwide citation)

Correction for temperature-induced non-uniformities in the response characteristics of the microbolometers in an infrared focal plane array (FPA) is performed by applying a non-uniform corrective bias to the individual microbolometers. The corrective bias is applied either before or during the bias ...


2
William J Parrish, James T Woolaway: Methods and circuitry for correcting temperature-induced errors in microbolometer focal plane array. Indigo Systems Corporation, David E Steuber, Skjerven Morrill MacPherson Franklin & Friel, May 26, 1998: US05756999 (51 worldwide citation)

Correction for temperature-induced non-uniformities in the response characteristics of the microbolometers in an infrared focal plane array (FPA) is performed by applying a non-uniform corrective bias to the individual microbolometers. The corrective bias is applied either before or during the bias ...


3
Jeffrey D Frank, Jeffrey Lynn Heath, Eugene Timothy Fitzgibbons: Interface device for extending camcorder use over the electromagnetic spectrum. Indigo Systems Corporation, MacPherson Kwok Chen & Heid, Greg J Michelson, May 23, 2006: US07050107 (42 worldwide citation)

An interface device connects a camcorder to a camera operating in the non-visible electromagnetic spectrum to form a portable unitary system. The interface device provides a mechanical connection between the camcorder and the camera. A video cable carries video image data from the camera to the camc ...


4
William J Parrish, Jeffrey B Barton: Method for electrically interconnecting large contact arrays using eutectic alloy bumping. Indigo Systems Corporation, MacPherson Kwok Chen & Heid, April 22, 2003: US06550665 (37 worldwide citation)

Methods of forming arrays of electrical interconnects between substrates are provided. These methods allow the use of large interconnect bump arrays to physically and electrically connect substrates without the need to use excess pressure on the substrates to form the interconnects, thus reducing da ...


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William J Parrish, Naseem Y Aziz: Two-stage auto-zero amplifier circuit for electro-optical arrays. Indigo Systems Corporation, Greg J Michelson, MacPherson Kwok Chen & Held, October 12, 2004: US06803555 (25 worldwide citation)

Two-stage auto-zero amplifier circuits are disclosed, along with methods of auto-zeroing such amplifier circuits. The two-stage auto-zero amplifier circuit may be part of an electronics signal chain coupled to a detector element to process an electronic signal induced by illumination. In an exemplar ...


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William J Parrish, Jeffrey L Heath, Naseem Y Aziz, Joseph Kostrzewa, George H Poe: Microbolometer focal plane array methods and circuitry. Indigo Systems Corporation, Greg J Michelson, MacPherson Kwok Chen & Heid, November 2, 2004: US06812465 (20 worldwide citation)

Microbolometer circuitry and methods are disclosed to allow an individual microbolometer or groups of microbolometers, such as a microbolometer focal plane array, to operate over a wide temperature range. Temperature compensation is provided, such as through circuitry and/or calibration methods, to ...


7
William J Parrish, Naseem Y Aziz, Glenn T Kincaid: Electro-optical sensor arrays with reduced sensitivity to defects. Indigo Systems Corporation, MacPherson Kwok Chen & Heid, July 15, 2003: US06593562 (19 worldwide citation)

An electro-optical sensor includes a detector pixel including a plurality of detector elements responsive to electromagnetic radiation, and a plurality of switches configurable to selectively combine signals from the detector elements in the detector pixel to provide a signal corresponding to a pixe ...


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William J Parrish, Naseem Y Aziz, Jeffrey L Heath, Theodore R Hoelter: Constant power snapshot microemitter array with integral digital interface, isolated substrate current return, and linearized signal response. Indigo Systems Corporation, David E Steuber, Skjerven Morrill & MacPherson, November 13, 2001: US06316777 (10 worldwide citation)

A dual sample-and-hold architecture in each unit cell of a read-in-integrated-circuit (RIIC) provides maximum frame rate without frame overlap. Analog pixel signals are updated sequentially in one sample-and-hold capacitor, while an emitter element displays a pixel of a display frame in response to ...


10
James T Woolaway, William J Parrish, Stephen H Black: Near complete charge transfer device. Raytheon Company, Indigo Systems Corporation, William C Schubert, Glenn H Lenzen Jr, October 17, 2000: US06133596 (10 worldwide citation)

A charge transfer structure (30) includes a substrate comprised of semiconductor material and, coupled to a surface of the substrate, a plurality of serially coupled devices each having a gate terminal. The plurality of serially coupled devices include a first single port device (D1) defining a firs ...