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Kazushige Ohno, Koji Shimato, Masahiro Tsuji: Honeycomb filter and ceramic filter assembly. Ibiden, Harold L Novick, Marvin C Berkowitz, Nath & Associates PLLC, December 30, 2003: US06669751 (195 worldwide citation)

A ceramic filter assembly having improved exhaust gas processing efficiency. The ceramic filter assembly (


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Ryo Enomoto, Motoo Asai, Yoshikazu Sakaguchi: Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same. Ibiden, Dvorak and Traub, December 29, 1992: US05175060 (188 worldwide citation)

A method of making a semiconductor-mounting substrate suitable for high density packaging and the substrate so made. In order to package an electron part having many terminals to be mounted in a high density, the substrate is constructed by using a lead frame comprised of a die pad and leads as a ba ...


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Kazuya Naruse, Satoshi Ohno, Koji Shimato, Hiroshi Okazoe, Seiki Iwahiro: Ceramic structural body. Ibiden, Nissan Diesel Motor, Greenblum & Bernstein, June 22, 1999: US05914187 (186 worldwide citation)

Ceramic structural body having improved material properties of a sealing member, such as adhesion properties at room temperature and high temperature, and having an improved durability. The ceramic structural body comprises an assembly of plural united ceramic members each having a plurality of thro ...


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Ohno Kazushige, Shimato Koji, Tsuji Masahiro: Honeycomb filter and ceramic filter assembly. Ibiden, October 10, 2001: EP1142619-A1 (142 worldwide citation)

A ceramic filter assembly having improved exhaust gas processing efficiency. The ceramic filter assembly (9) is produced by adhering with a ceramic seal layer (15) outer surfaces of a plurality of filters (F1), each of which is formed from a sintered porous ceramic body. The seal layer (15) has a th ...


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Motoo Asai, Takashi Kariya: Multilayer printed-circuit board and semiconductor device. Ibiden, Greenblum & Bernstein, March 18, 2003: US06534723 (128 worldwide citation)

A multilayer printed-circuit board is provided which is formed by stacking one on the other a plurality of circuit boards, each including a hard insulative substrate having a conductor circuit formed on one or either side thereof, and having formed therein via-holes formed through the hard insulativ ...


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Ryo Enomoto, Motoo Asai: Adhesive for electroless plating, printed circuit boards and method of producing the same. Ibiden, Sandler Greenblum & Bernstein, October 8, 1991: US05055321 (95 worldwide citation)

An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adh ...


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Katsuo Kawaguchi, Hirofumi Futamura, Yukinobu Mikado, Sotarou Ito: Flex-rigid wiring board. Ibiden, Oblon Spivak McClelland Maier & Neustadt P C, September 9, 2008: US07423219 (92 worldwide citation)

In a flex-rigid wiring board in which a rigid substrate formed from a rigid base material and a flexible substrate formed from a flexible base material are stack-joined and electrically connected to each other, the flexible substrate including a conductive layer having interconnecting electrode pads ...


10
Kazushige Ohno, Koji Shimato, Masahiro Tsuji: Honeycomb filter and ceramic filter assembly. Ibiden, Nath & Associates PLLC, Harold L Novick, September 26, 2006: US07112233 (85 worldwide citation)

A ceramic filter assembly having improved exhaust gas processing efficiency. The ceramic filter assembly (9) is produced by adhering with a ceramic seal layer (15) outer surfaces of a plurality of filters (F1), each of which is formed from a sintered porous ceramic body. The seal layer (15) has a th ...