1
Naoki Fukutomi, Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara, Noriyuki Taguchi, Hiroshi Nomura: Fabrication process of semiconductor package and semiconductor package. Hitachi Chemical Company, Pennie & Edmonds, November 2, 1999: US05976912 (291 worldwide citation)

A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are con ...


2
Hiroyuki Kuriya, Shinsuke Hagiwara: Method of producing boards for printed wiring. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 12, 1995: US05449480 (130 worldwide citation)

A method of producing a board for printed wiring comprising disposing a metal foil in a plate-shape cavity of a mold so that the metal foil is in contact with at least one internal side of the cavity, injecting a molding material comprising an epoxy resin, a hardening agent and a powdery inorganic f ...


3
Naoyuki Urasaki, Yasusi Simada, Yoshiyuki Tsuru, Akishi Nakaso, Itsuo Watanabe: Substrate for mounting semiconductor chips. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, August 28, 2001: US06281450 (114 worldwide citation)

A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the ...


4
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yoshikatsu Mikami, Kuniteru Muto, Yoshiyuki Ikezoe: Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained. Hitachi Chemical Company, Antonelli Terry & Wands, April 26, 1988: US04740657 (111 worldwide citation)

Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or flim capable of exhibiting anisotropic-electroconductivity comprising electroconductive particles comprising polymeric core materials coated with thin metal layers, and electrically insul ...


5
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, March 19, 1991: US05001542 (97 worldwide citation)

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having ...


6
Isao Tsukagoshi, Yutaka Yamaguchi, Atsuo Nakajima, Yasushi Goto: Method of using an anisotropically electroconductive adhesive having pressure-deformable electroconductive particles to electrically connect circuits. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, June 9, 1992: US05120665 (91 worldwide citation)

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having ...


7
Mitsuru Ikei, Masahiko Hashimoto, Takeshi Noguchi: Simultaneous data and electric power transmitting/receiving system. Hitachi Chemical Company, Jones Askew & Lunsford, March 26, 1991: US05003457 (65 worldwide citation)

A data and power transmitting/receiving system applicable to a home automation system. Plural terminal units and associated communication units are connected via a common signal bus. Each terminal unit may operate an electrical load to be controlled remotely, and may include control switches for ope ...


8
Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono: Electrostatic protective device and method for fabricating same. Hitachi Chemical Company, Dickstein Shapiro Morin & Oshinsky, June 29, 1999: US05915757 (62 worldwide citation)

Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional d ...


9
Akishi Nakaso, Toshiro Okamura, Haruo Ogino, Tomoko Watanabe, Yuko Kimura: Process for treating copper surface. Hitachi Chemical Company, Antonelli Terry & Wands, February 20, 1990: US04902551 (58 worldwide citation)

Adhesion of copper to a resin layer is improved by reducing a copper oxide layer with an aqueous aldehyde solution (a) while applying a potential of -1000 mV to -400 mV to the copper oxide layer, (b) after contacting with a metal piece made of copper or a metal nobler than copper, or (c) after conta ...


10
Eiichi Shinada, Masao Kanno, Yuuichi Shimayama, Yoshiyuki Tsuru, Takeshi Horiuchi: Circuit boards using heat resistant resin for adhesive layers. Hitachi Chemical Company, Antonelli Terry Stout & Kraus, September 19, 2000: US06121553 (55 worldwide citation)

An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having ...