1
Thomas Meeus, Hans Korsse, Ravindra M Bhatkal: Electroformed stencils for solar cell front side metallization. Fry s Metals, Lando & Anastasi, July 6, 2010: US07749883 (31 worldwide citation)

A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at le ...


2
Kenneth B Gilleo, Michael C Corey: Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials. Fry s Metals, Shapiro and Shapiro, June 10, 1997: US05637176 (23 worldwide citation)

Ordered Z-axis electroconductive sheet materials are produced by entrapping bodies of fusible, polymeric, electroconductive adhesive at predetermined spaced locations in a sheet-like carrier of fusible, polymeric, dielectric adhesive including a thermoplastic component. The materials are useful for ...


3
Alvin F Schneider, David B Blumel, Jack Brous: Rosin-free, low VOC, no-clean soldering flux and method using the same. Fry s Metals, Shapiro and Shapiro, November 5, 1996: US05571340 (19 worldwide citation)

A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8% by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amou ...


4
Alvin F Schneider, David B Blumel, John V Tomczak: No-clean soldering flux and method using the same. Fry s Metals, Shapiro and Shapiro, March 29, 1994: US05297721 (18 worldwide citation)

A no-clean soldering flux consists essentially of one or more halide-free, water soluble activators in an aggregate amount not exceeding about 5% by weight of the flux, a water soluble fluorinated surfactant in an amount not exceeding about 1% by weight of the flux, and water. The flux is substantia ...


5
Lewis Brian, Singh Bawa, Laughlin John P, Kyaw David V, Ingham Anthony: Thermal interface material and solder preforms. Fry S Metals, Lewis Brian, Singh Bawa, Laughlin John P, Kyaw David V, Ingham Anthony, FLEISCHUT Paul IJ, July 14, 2005: WO/2005/064677 (16 worldwide citation)

A solder preform (5,12) having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettabili ...


6
Brian G Lewis, Bawa Singh, John P Laughlin, David V Kyaw, Anthony E Ingham, Attiganal N Sreeram, Leszek Hozer, Michael J Liberatore, Gerard R Minogue: Thermal interface material and solder preforms. Fry s Metals, Senniger Powers, March 6, 2007: US07187083 (13 worldwide citation)

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A t ...


7
Kenneth B Gilleo, Michael C Corey: Method of making electroconductive adhesive particles for Z-axis application. Fry s Metals, Shapiro and Shapiro, July 2, 1996: US05531942 (13 worldwide citation)

Electroconductive resin adhesive particles are incorporated in a dielectric-resin-adhesive-containing carrier to form a Z-axis adhesive. Particles are preferably produced by printing techniques or by in-fluid forming techniques, the latter being particularly suited for the formation of substantially ...


8
Charles E King, Angelo J Gulino: Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors. Fry s Metals, Mintz Levin Cohn Ferris Glovsky and Popeo PC, August 4, 1998: US05789068 (12 worldwide citation)

The invention provides a solder preform coated with a predetermined thickness of parylene which physically and chemically protects the preform, as well as a provides a unique optical interference coating which reflects at characteristic frequencies. When predetermined thicknesses of parylene are sel ...


9
Michael Murphy, Eric Schmidt, Aly Diaz: System and method for modifying electronic design data. Fry s Metals, Mintz Levin Cohn Ferris Glovsky and Popeo P C, August 30, 2005: US06938227 (11 worldwide citation)

Customer data relating to the location and character of features (e.g., conductive pads to which electronic parts are soldered on a printed circuit board) are stored in a digital form (e.g., as “Gerber data”). A library of footprints that characterize the features is created from this data. A footpr ...


10
Sanyogita Arora, Gerard R Minogue: Coating solder metal particles with a charge director medium. Fry s Metals, Senniger Powers, August 19, 2008: US07413771 (6 worldwide citation)

A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the c ...