1
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of planarizing tips of probe elements of a probe card assembly. FormFactor, David J Larwood, Gerald E Linden, November 2, 1999: US05974662 (326 worldwide citation)

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the spa ...


2
Igor Y Khandros, Gaetan L Mathieu: Flexible contact structure with an electrically conductive shell. FormFactor, David Larwood, Gerald Linden, June 29, 1999: US05917707 (267 worldwide citation)

An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the f ...


3
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu: Fabricating interconnects and tips using sacrificial substrates. FormFactor, Gerald Linden, Daivd Larwood, November 30, 1999: US05994152 (245 worldwide citation)

Interconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate esta ...


4
Igor Y Khandros, Benjamin N Eldridge, Gaetan L Mathieu, Thomas H Dozier, William D Smith: Contact carriers (tiles) for populating larger substrates with spring contacts. FormFactor, Gerald E Linden, Fenwick & West, September 15, 1998: US05806181 (235 worldwide citation)

The invention relates to making temporary, pressure connections between electronic components and, more particularly, to techniques for performing test and burn-in procedures on semiconductor devices prior to their packaging, preferably prior to the individual semiconductor devices being singulated ...


5
Gaetan L Mathieu, Benjamin N Eldridge, Gary W Grube: Lithographic contact elements. FormFactor, Blakely Sokoloff Taylor & Zafman, July 3, 2001: US06255126 (227 worldwide citation)

A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structu ...


6
Igor Y Khandros, David V Pedersen: Wafer-level burn-in and test. FormFactor, David Larwood, Gerald E Linden, May 16, 2000: US06064213 (218 worldwide citation)

Wafer-level burn-in and test of semiconductor devices under test (DUTs) includes a test substrate having active electronic components (e.g. ASICs) secured to an interconnection substrate, spring contact elements effecting interconnections between the ASICs and the DUTs. This is advantageously perfor ...


7
Gary W Grube: Microelectronic spring with additional protruding member. Formfactor, Ken Burraston, O&apos Melveny & Myers, November 2, 2004: US06811406 (200 worldwide citation)

Various structural features for modifying the performance characteristic of cantilevered microelectronic spring structures are disclosed. Generally, the features comprise a protruding member mounted between a supporting substrate and the transverse cantilever beam of a microelectronic spring structu ...


8
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of mounting resilient contact structures to semiconductor devices. FormFactor, David Larwood, Gerald Linden, November 3, 1998: US05829128 (199 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


9
Igor Y Khandros, Gaetan L Mathieu: Composite interconnection element for microelectronic components, and method of making same. FormFactor, Blakely Sokoloff Taylor & Zafman, February 29, 2000: US06029344 (186 worldwide citation)

Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by shaping an elongate element (core) of a soft material (such as gold) to have a springable shape (including cantilever beam, S-shape, U- ...


10
Benjamin N Eldridge, Igor Y Khandros, Gaetan L Mathieu, David V Pedersen: Method of making microelectronic spring contact elements. FormFactor, Gerald E Linden, David Larwood, February 6, 2001: US06184053 (185 worldwide citation)

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contac ...