1
Thomas H Dozier II, Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Sockets for electronic components and methods of connecting to electronic components. Form Factor, David J Larwood, Gerald E Linden, June 30, 1998: US05772451 (372 worldwide citation)

Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom s ...


2
Igor Y Khandros: Method of manufacturing electrical contacts, using a sacrificial member. Form Factor, Gerald E Linden, December 19, 1995: US05476211 (317 worldwide citation)

A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional ...


3
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of making temporary connections between electronic components. Form Factor, Gerald E Linden, David J Larwood, November 10, 1998: US05832601 (168 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


4
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of making contact tip structures. Form Factor, David Larwood, Gerald Linden, February 2, 1999: US05864946 (155 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


5
Igor Y Khandros: Method of making raised contacts on electronic components. Form Factor, David Larwood, Gerald Linden, December 29, 1998: US05852871 (131 worldwide citation)

A method for manufacturing raised contacts on the surface of an electronic component includes bonding one end of a wire to an area, such as a terminal, of the electronic component, and shaping the wire into a wire stem configuration (including straight, bent two-dimensionally, bent three-dimensional ...


6
Thomas H Dozier II, Igor Y Khandros: Solder preforms. Form Factor, David J Larwood, Gerald E Linden, October 13, 1998: US05820014 (122 worldwide citation)

Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon ...


7
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Method of testing semiconductor. Form Factor, Gerald Linden, David Larwood, December 7, 1999: US05998228 (110 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


8
Benjamin N Eldridge, Gary W Grube, Igor Y Khandros, Gaetan L Mathieu: Mounting spring elements on semiconductor devices. Form Factor, Gerald Linden, David Larwood, March 23, 1999: US05884398 (100 worldwide citation)

Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit ...


9
Benjamin N Eldridge, Igor Y Khandros, Gaetan L Mathieu: Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component. Form Factor, David Larwood, Gerald Linden, June 15, 1999: US05912046 (79 worldwide citation)

A flowable coating material, such as a liquid having solids in suspension, such as spin-on glass, is applied to a surface of an electronic component by placing the component in a centrifuge and spinning the component about a first axis so that the liquid material is forced against the surface of the ...


10