1
Richard H Estes, Frank W Kulesza: Flip chip technology using electrically conductive polymers and dielectrics. Epoxy Technology, Hamilton Brook Smith & Reynolds, December 24, 1991: US05074947 (143 worldwide citation)

A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Electrically conductive polymer ...


2
Frank W Kulesza, Richard H Estes: Flip chip bonding method using electrically conductive polymer bumps. Epoxy Technology, Hamilton Brook Smith & Reynolds, March 23, 1993: US05196371 (131 worldwide citation)

A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. A first organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. An electrically conductive ...


3
Frank W Kulesza, Richard H Estes: Method of forming electrically conductive polymer interconnects on electrical substrates. Epoxy Technology, Fish & Richardson P C, March 18, 1997: US05611140 (102 worldwide citation)

A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least ...


4
Frank W Kulesza, Richard H Estes: Flip chip technology using electrically conductive polymers and dielectrics. Epoxy Technology, Hamilton Brook Smith & Reynolds, August 17, 1993: US05237130 (101 worldwide citation)

A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Monomer is formed on the bond p ...


5
Thomas W Tamulevich: Face finishing tool for fiber optic communication cable. Epoxy Technology, Kenway & Jenney, June 16, 1981: US04272926 (25 worldwide citation)

A tool for finishing a termination on a fiber optic cable has a base element cast of synthetic resin material to form a reference surface and a mounting passage, and mounts a connector element in the passage adjustably for calibrated repositioning relative to the reference surface.


6
Charles E Banfield: Method and compositions for removal of moisture. Epoxy Technology, Lahive & Cockfield, January 20, 1987: US04637197 (16 worldwide citation)

Methods and compositions are disclosed for absorbing moisture when moisture constraints are present. The moisture absorbing compositions include a curable epoxy resin, a curing agent, and an anhydride of a carboxylic acid. In one embodiment, the anhydride component is present in an amount sufficient ...


7
Estes Richard H, Kulesza Frank W: Flip chip technology using electrically conductive polymers and dielectrics. Epoxy Technology, January 3, 1996: EP0690490-A2 (4 worldwide citation)

A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. An electrically conductive poly ...


8
Banfield Charles E: Methods and compositions for removal of moisture.. Epoxy Technology, August 6, 1986: EP0189631-A1 (2 worldwide citation)

Methods and compositions are disclosed which entail the use of epoxy resins for absorbing moisture when moisture constraints are present. The moisture absorbing compositions include a curable epoxy resin, a curing agent, and an anhydride of a carboxylic acid, the latter in one instance being present ...


9
Estes Richard H, Kulesza Frank W: Flip chip technology using electrically conductive polymers and dielectrics. Epoxy Technology, REYNOLDS Leo R, June 27, 1991: WO/1991/009419

A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. An electrically conductive poly ...


10
Kulesza Frank W, Estes Richard H: Method of forming electrically conductive polymer interconnects on electrical substrates. Epoxy Technology, SHARKANSKY Richard M, February 23, 1995: WO/1995/005675

A method is presented for forming a bumped substrate and for forming an electrical circuit which includes the bumped substrate. The method of forming the bumped substrate includes forming at least one electrically conductive polymer bump on each of a first set of bond pads of the substrate. At least ...