1
Charles William Eichelberger: Single chip modules, repairable multichip modules, and methods of fabrication thereof. EPIC Technologies, Heslin & Rothenberg P C, November 24, 1998: US05841193 (451 worldwide citation)

Multichip and single chip modules are presented as well as a chips first fabrication of such modules. The multichip module comprises a plurality of chips affixed in a planar array by a structural material which surrounds the sides of the chips such that the upper surfaces of the chips and an upper s ...


2
Charles W Eichelberger, James E Kohl: Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, November 17, 2009: US07619901 (298 worldwide citation)

Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer i ...


3
Charles William Eichelberger: Single chip modules, repairable multichip modules, and methods of fabrication thereof. EPIC Technologies, Heslin & Rothenberg P C, December 12, 2000: US06159767 (182 worldwide citation)

Multichip and single chip modules are presented as well as a chips first fabrication of such modules. The multichip module comprises a plurality of chips affixed in a planar array by a structural material which surrounds the sides of the chips such that the upper surfaces of the chips and an upper s ...


4
Charles W Eichelberger, James E Kohl, Michael E Rickley: Electroless metal connection structures and methods. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, May 28, 2002: US06396148 (176 worldwide citation)

Chips first packaging structures and methods of fabrication are presented which employ electroless metallizations. An electroless barrier metal is disposed over and in electrical contact with at least one aluminum contact pad of the chips first integrated circuit. The electroless barrier metal is a ...


5
Charles W Eichelberger, James E Kohl: Compliant, solderable input/output bump structures. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, April 29, 2003: US06555908 (114 worldwide citation)

Structures and methods are provided for electrically interconnecting and absorbing stress between a first electrical structure and a second electrical structure. In one embodiment, non-conductive compliant bumps are disposed on at least one of the structures and a metal layer is provided over a surf ...


6
Charles W Eichelberger, James E Kohl: Compliant, solderable input/output bump structures. Epic Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, November 16, 2004: US06818544 (88 worldwide citation)

Structures and methods are provided for electrically interconnecting and absorbing stress between a first electrical structure and a second electrical structure. In one embodiment, non-conductive compliant bumps are disposed on at least one of the structures and a metal layer is provided over a surf ...


7
Charles W Eichelberger, James E Kohl: Integrated circuit structures and methods employing a low modulus high elongation photodielectric. EPIC Technologies, Kevin P Radigan Esq, Heslin Rothenberg Farley & Mesiti P C, July 30, 2002: US06426545 (82 worldwide citation)

Structures and methods are provided for absorbing stress between a first electrical structure and a second electrical structure connected together, wherein the first and second structures have different coefficients of thermal expansion. A dielectric material is disposed on at least one of the first ...


8
Donald V Nowicki, Christopher A Munroe: Abnormal tire condition warning system. Epic Technologies, Fay Sharpe Beall Fagan Minnich & McKee, February 8, 1994: US05285189 (80 worldwide citation)

A device is provided for sensing the condition of a pneumatic tire preferably of the type used on an automobile wherein the tire is mounted on a tire rim. The device comprises a housing, a band for mounting the housing to the tire rim, a sensor for monitoring the condition within the tire, circuitry ...


9
Charles W Eichelberger, Paul V Starenas: Structure and method for temporarily holding integrated circuit chips in accurate alignment. EPIC Technologies, Kevin P Radigan Esq, Brett M Hutton Esq, Heslin Rothenberg Farley & Mesiti P C, September 26, 2006: US07112467 (78 worldwide citation)

Structure and method for temporarily holding at least one integrated circuit chip during packaging thereof are presented. A support plate has a release film secured to a main surface thereof. The support plate and release film allow UV light to pass therethrough. A UV curable chip adhesive is dispos ...


10
Donald V Nowicki, Christopher A Munroe: Data logging tire monitor with condition predictive capabilities and integrity checking. Epic Technologies, Fay Sharpe Beall Fagan Minnich & McKee, September 24, 1996: US05559484 (41 worldwide citation)

A device is provided for sensing a condition of a non-rotating pneumatic tire preferably of the type used on an automobile wherein the tire is mounted on a tire rim. The device comprises a housing, a band for mounting the housing to the tire rim, a sensor for monitoring the condition within the tire ...