1
Katsuyuki Musaka
Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka: Plating apparatus. Ebara Corporation, Wenderoth Lind & Ponack L, March 8, 2011: US07901550 (2 worldwide citation)

A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves a ...


2
Hirokuni Hiyama, Yutaka Wada: Polishing apparatus including thickness or flatness detector. Ebara Corporation, Wenderoth Lind & Ponack L, November 17, 1998: US05838447 (147 worldwide citation)

A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring dispose ...


3
Hiroaki Inoue, Kenji Nakamura, Moriji Matsumoto: Electroless plating liquid and semiconductor device. Ebara Corporation, Wenderoth Lind & Ponack L, April 6, 2004: US06717189 (147 worldwide citation)

The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded i ...


4
Kazuo Ohkubo, Tadamasa Hayashi, Hiroshi Nagai: Hollow fiber filter device. Ebara Corporation, Wenderoth Lind & Ponack, October 24, 1989: US04876006 (138 worldwide citation)

A hollow fiber filter device has a filter casing which is partitioned by a horizontal member into a filtered liquid chamber and a filtering chamber and a plurality of filter modules are suspended downwardly from the horizontal member. Each of the modules includes a plurality of hollow fibers having ...


5
Yukio Fukunaga, Hiroyuki Shinozaki, Kiwamu Tsukamoto, Masao Saitoh: Reactant gas ejector head. Ebara Corporation, Wenderoth Lind & Ponack L, September 14, 1999: US05950925 (121 worldwide citation)

A reactant gas ejector head enables a process gas mixture of a uniform concentration and composition to be delivered to the surface of a substrate in a stable and uniform thermodynamic state by preventing premature reactions to occur along the gas delivery route. The reactant gas ejector head compri ...


6
Masahiro Minami, Hiroaki Ichikawa, Masahito Kawai, Yukio Murai, Kaoru Nakajima: Method and device for controlling photovoltaic inverter, and feed water device. Ebara Corporation, Fuji Electric Holdings, Young & Thompson, October 24, 2006: US07126294 (108 worldwide citation)

A photovoltaic inverter control method includes steps of monitoring a variation in output voltage of a solar battery by a power and voltage monitoring circuit (51) and, when the variation occurs, accelerating or decelerating an electric motor (3) to maximize the output voltage of the solar battery ( ...


7
Tsutomu Takahashi, Keiichi Tohyama, Tamami Takahashi: Polishing apparatus having endpoint detection device. Ebara Corporation, Wenderoth Lind & Ponack, September 30, 1997: US05672091 (105 worldwide citation)

A polishing apparatus has an automated endpoint detection device to determine if an endpoint of polishing has been reached without removing the wafer from a top ring of the polishing apparatus. When a pre-determined inspection time is reached in a process of polishing, the wafer is moved laterally a ...


8
Kuniaki Horie, Hidenao Suzuki, Tsutomu Nakada, Fumio Kuriyama, Takeshi Murakami, Masahito Abe, Yuji Araki: Vaporizer apparatus and film deposition apparatus therewith. Ebara Corporation, Wenderoth Lind & Ponack L, September 14, 1999: US05951923 (104 worldwide citation)

A vaporizer apparatus efficiently vaporizes difficult-to-vaporize materials such as complex feed materials for producing a high dielectric or ferroelectric material. The vaporizer apparatus includes a vaporizing passage formed by a pair of opposed walls separated by a minute spacing to a liquid feed ...


9
Takayuki Saito, Ken Nakajima, Yoki Iwase, Yukio Ikeda, Hiroyuki Shima: Process and system for purifying pure water or ultrapure water. Ebara Corporation, Ebara Research, Oblon Spivak McClelland Maier & Neustadt, December 17, 1991: US05073268 (100 worldwide citation)

Ultrapure water of extremely high purity, i.e. a so-called ultra-ultrapure water is formed by the present system for purifying a pure water or ultrapure water, (1) the TOC component which was contained in pipes, etc. and which was subsequently dissolved in a pure water or ultrapure water to be treat ...


10
Takeshi Murakami, Noriyuki Takeuchi, Hiroyuki Shinozaki, Kiwamu Tsukamoto, Yukio Fukunaga, Akihisa Hongo: Reactant gas ejector head and thin-film vapor deposition apparatus. Ebara Corporation, Wenderoth Lind & Ponack, March 17, 1998: US05728223 (92 worldwide citation)

A reactant gas ejector head in a thin-film vapor deposition apparatus includes at least two reactant gas inlet passages for introducing reactant gases, a gas mixing chamber for mixing reactant gases introduced from the reactant gas inlet passages, and a nozzle disposed downstream of the gas mixing c ...



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