1
Too Seah Sun, Khan Mohammad, Hayward James, Diep Jacquana: Integrated circuit packaging. Advanced Micro Devices, Too Seah Sun, Khan Mohammad, Hayward James, Diep Jacquana, DRAKE Paul S, December 13, 2007: WO/2007/142721 (15 worldwide citation)

Various integrated circuit package elements are provided. In one aspect, an integrated circuit package device is provided that includes a lid (20) for covering an integrated circuit (12). The lid (20) has a convex surface (40) for applying pressure on the integrated circuit (12) when the Hd (20) is ...


2
Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad: Integrated circuit socket. Advanced Micro Devices, Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad, DRAKE Paul S, September 25, 2008: WO/2008/115453

Various sockets for packaged integrated circuits and methods of making the same are provided. In one aspect, a method of mounting a semiconductor chip (105) is provided that includes providing a package (110) that has a base substrate (115) with a first side and a second side opposite the first side ...


3
Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad: Reduction of damage to thermal interface material due to asymmetrical load. Advanced Micro Devices, Too Seah Sun, Master Raj N, Diep Jacquana, Khan Mohammad, DRAKE Paul S, February 21, 2008: WO/2008/021072

Various method and apparatus for packaging an integrated circuit (52) are provided. In one aspect, a method of packaging an integrated circuit (32) is provided that includes coupling an integrated circuit (52) to a substrate (54), mixing an adhesive (58) with a plurality of particles (82), and coupl ...


4
NA Young Hye, SOORIYAKUMARAN Ratnam, VORA Ankit, DIEP Jacquana T: MEMBRANES COMPOSITES À COUCHES MINCES INTÉGRÉES AVEC DES COMPOSÉS CAGES MOLÉCULAIRES, THIN FILM COMPOSITE MEMBRANES EMBEDDED WITH MOLECULAR CAGE COMPOUNDS. INTERNATIONAL BUSINESS MACHINES CORPORATION, NA Young Hye, SOORIYAKUMARAN Ratnam, VORA Ankit, DIEP Jacquana T, GWIN H Sanders Jr, January 10, 2013: WO/2013/006288

A polymeric membrane on a support, wherein the polymeric membrane includes a crosslinked polymer covalently bound to a molecular cage compound. An interfacial polymerization method for making the polymeric membrane is also disclosed.