1
Floyd Eide: Integrated circuit chip stacking. Dense Pac Microsystems, Spensley Horn Jubas & Lubitz, September 11, 1990: US04956694 (287 worldwide citation)

A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of th ...


2
Floyd K Eide, John A Forthun, Harlan Isaak: Chip stack and method of making same. Dense Pac Microsystems, Loeb & Loeb, March 18, 1997: US05612570 (157 worldwide citation)

An integrated circuit chip stack includes a stack of chip packages mounted on a substrate. Each chip package includes a plastic packaged chip mounted within a central aperture in a thin, planar frame by soldering leads at opposite ends of the plastic package to conductive pads on an upper surface of ...


3
Aaron Uri Levy, John Patrick Sprint, John Arthur Forthun, Harlan Ruben Isaak, Joel Andrew Mearig, Mark Chandler Calkins: Modular panel stacking process. Dense Pac Microsystems, John P Scherlacher, Loeb & Loeb, February 9, 1999: US05869353 (120 worldwide citation)

A method of making chip stacks begins with the formation of a plurality of panels having apertures therein and conductive pads on opposite sides thereof. Solder paste is deposited on the conductive pads prior to mounting plastic packaged IC chips within each of the apertures in each of the panels so ...


4
Floyd K Eide: IC chip package having chip attached to and wire bonded within an overlying substrate. Dense Pac Microsystems, Spensley Horn Jubas & Lubitz, May 17, 1994: US05313096 (118 worldwide citation)

An IC chip package includes a chip having an upper active surface thereof bonded to the lower surface of a substrate. A plurality of terminals on the active surface are wire bonded within the outer periphery of the chip by bonding wires extending through a plurality of apertures in a lower layer of ...


5
Harlan R Isaak: Stackable flex circuit IC package and method of making same. Dense Pac Microsystems, Stetina Brunda Garred & Brucker, November 27, 2001: US06323060 (110 worldwide citation)

A stackable flex circuit IC package includes a flex circuit comprised of a flexible base with a conductive pattern thereon, and wrapped around at least one end portion of a frame so as to expose the conductive pattern at the edge portion. An IC device is mounted within a central aperture in the fram ...


6
Ted Bruce, John A Forthun: Chip stack with differing chip package types. Dense Pac Microsystems, Stetina Brunda Garred & Brucker, September 30, 2003: US06627984 (77 worldwide citation)

A chip stack comprising a flex circuit which itself comprises a flexible substrate having opposed, generally planar top and bottom surfaces. Disposed on the top surface of the substrate in spaced relation to each other are at least first and second top conductive patterns. Similarly, disposed on the ...


7
Andrew C Ross: Universal package and method of forming the same. Dense Pac Microsystems, Stetina Brunda Garred & Brucker, April 24, 2001: US06222737 (73 worldwide citation)

A chip module comprising a chip array which includes an interconnect substrate having opposed, generally planar surfaces and a first interconnect pad array disposed on at least one of the surfaces thereof. Attached to the interconnect substrate is at least one integrated circuit chip of the chip arr ...


8
Harlan R Isaak: Panel stacking of BGA devices to form three-dimensional modules. Dense Pac Microsystems, Stetina Brunda Garred & Brucker, June 11, 2002: US06404043 (61 worldwide citation)

A chip stack comprising at least two base layers, each of which includes a base substrate and a first conductive pattern disposed on the base substrate. The chip stack further comprises at least one interconnect frame having a second conductive pattern disposed thereon. The interconnect frame is dis ...


9
Isaak Harlan R: Panel stacking of bga devices to form three-dimensional modules. Dense Pac Microsystems, April 1, 2002: TW481877 (1 worldwide citation)

A chip stack comprising at least two base layers, each of which includes a base substrate and a first conductive pattern disposed on the base substrate. The chip stack further comprises at least one interconnect frame having a second conductive pattern disposed thereon. The interconnect frame is dis ...


10
Issak Harlan R: Stackable flex circuit ic package and method of making the same. Dense Pac Microsystems, April 3, 2002: EP1192658-A1

A stackable flex circuit IC package includes a flex circuit comprised of a flexible base (32) with a conductive pattern (20) thereon, and wrapped around at least one end portion of a frame (18) so as to expose the conductive pattern at the edge portion. An IC device (50) is mounted within a central ...