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Tsutomu Ueyama, Hideki Adachi, Yoshio Matsumura, Yasuhide Tanaka: Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus. Dainippon Screen MFG, Ostrolenk Faber Gerb & Soffen, November 5, 1996: US05571325 (144 worldwide citation)

A substrate processing apparatus comprises a processing part and a transferring part. In the processing part there are a plurality of stages in which a plurality of processing units are arranged in a row along a horizontal direction and the stages are arranged in a stack vertically. Thus, the proces ...


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Akira Matsumura: Data conversion table changing. Dainippon Screen MFG, McDermott Will & Emery, March 9, 1999: US05881211 (112 worldwide citation)

In a three-dimensional LUT for color conversion, the values of converted color component data C', M', and Y' are varied for a specific combination of the values of color component data C, M, and Y representing white, and the values of converted data are then changed for other combinations accompanie ...


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Kaoru Shinbara: Wafer holding mechanism. Dainippon Screen Mfg Co, Ostrolenk Faber Gerb & Soffen, December 6, 1988: US04788994 (105 worldwide citation)

A wafer holding mechanism horizontally holds, one at a time, wafers which are sequentially transported thereto. Wafers are treated with liquids such as an etchant, rinsing liquid, and the like, at the same time that the wafer is rotated at a high speed. The mechanism includes a hollow rotary shaft h ...


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Tetsuo Sano, Tetsuo Hohki, Eiji Kodama, Takumi Yoshida, Masafumi Kawatani, Hisayuki Tsujinaka: System for inspecting pattern defects of printed wiring boards. Dainippon Screen Mfg Co, Brumbaugh Graves Donohue & Raymond, January 17, 1989: US04799175 (104 worldwide citation)

Printed wiring boards (PWBs) applied to this inspection system are previously formed with marks in prescribed positional relation to wiring patterns. Deviation of PWBs with respect to absolute coordinates of the inspection system is detected by reading the marks. The PWBs are sequentially set one by ...


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Mitsukazu Takahashi, Takatoshi Chiba, Kiyofumi Nishii: Apparatus for heat-treating wafer by light-irradiation and device for measuring temperature of substrate used in such apparatus. Dainippon Screen MFG, Lowe Price LeBlanc & Becker, May 24, 1994: US05315092 (101 worldwide citation)

A temperature measuring device for measuring the temperature of a wafer heated by light irradiation includes: a sheath thermocouple for detecting the temperature of a wafer to be measured by contacting the wafer to be measured; and a covering member for covering the surface of the sheath thermocoupl ...


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Hisao Nishizawa, Masaru Morita, Masato Tanaka: Method and apparatus for surface treating of substrates. Dainippon Screen MFG, Lowe Price LeBlanc Becker & Shur, October 3, 1989: US04871417 (97 worldwide citation)

A method for surface treating of thin substrates such as semiconductor wafers, wherein a semiconductor wafer formed with relatively deep but transversely minute trenches on its surface is horizontally placed on a spinner in a chamber with its trenched surface directed up, ultraviolet light is then e ...


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Hiromi Chaya, Takahisa Hayashi, Shigekazu Komatsu: Probe mark reading device and probe mark reading method. Dainippon Screen MFG, Tokyo Electron, McDermott Will & Emery, April 11, 2006: US07026832 (96 worldwide citation)

A probe mark reading device for reading probe marks stormed on electrode pads of semiconductor chips contained in a semiconductor wafer (90), comprising a CCD camera (20) for taking an image of the semiconductor wafer (90) and outputting the image as an image signal Si, an optical unit (21) for opti ...


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Masato Tanaka, Hisao Nishizawa, Nobuyuki Hirai, Kaoru Shinbara, Hitoshi Yoshioka: Wafer cleaning method and apparatus therefore. Dainippon Screen MFG, February 22, 1994: US05288333 (95 worldwide citation)

A wafer cleaning method and apparatus in which a cleaning solution is caused to evaporate at a temperature below its boiling point, and cleaning vapor thus produced is applied at a temperature above its dew point to a wafer such as a semiconductor wafer. The wafer is cleaned without formation of col ...


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Matsumura Akira: Data conversion table changing. Dainippon Screen MFG, June 18, 1997: EP0779736-A2 (91 worldwide citation)

In a three-dimensional LUT for color conversion, the values of converted color component data C', M', and Y' are varied for a specific combination of the values of color component data C, M, and Y representing white, and the values of converted data are then changed for other combinations accompanie ...