1
Craig Allen
Craig Allen Jarrard: Non-contacting position sensor using a rotating magnetic vector. CTS Corporation, Mark P Bourgeois, Daniel J Deneufbourg, June 22, 2010: US07741839 (6 worldwide citation)

A sensor for sensing the position of an object includes a magnet and a magnetic flux sensor. The magnet has dimensions that include a length, a width and a height. The magnet is adapted to generate a flux field. The flux field has a magnitude of flux and a flux direction. The flux direction changes ...


2
Craig Allen
Craig Allen Jarrard: Non-contacting position sensor using a rotating magnetic vector. CTS Corporation, Daniel J Deneufbourg, September 20, 2011: US08022694

A sensor for sensing the position of an object includes a magnet and a magnetic flux sensor. The magnet has dimensions that include a length, a width and a height. The magnet is adapted to generate a flux field. The flux field has a magnitude of flux and a flux direction. The flux direction changes ...


3
Craig Allen
Craig Allen Jarrard: Non-contacting position sensor using a rotating magnetic vector. CTS Corporation, Cts Corporation, April 26, 2007: US20070090827-A1

A sensor for sensing the position of an object includes a magnet and a magnetic flux sensor. The magnet has dimensions that include a length, a width and a height. The magnet is adapted to generate a flux field. The flux field has a magnitude of flux and a flux direction. The flux direction changes ...


4
Michael J Anderson, Gregory Kennison, Jeffrey E Christensen, Gary C Johnson, Jon G Aday: Surface acoustic wave device package and method. CTS Corporation, Jones Day Reavis & Pogue, October 19, 1999: US05969461 (96 worldwide citation)

A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave devi ...


5
Shawki Ibrahim, James E Elsner: Multi-layer ceramic package. CTS Corporation, John A Young, Larry J Palguta, March 16, 1982: US04320438 (72 worldwide citation)

In a multi-layer ceramic package, a plurality of ceramic lamina each has a conductive pattern, and there is an internal cavity of the package within which is bonded a chip or a plurality of chips intereconnected to form a chip array. The chip or chip array is connected through short wire bonds at va ...


6
Gary Vaughn: Pulse frequency modulation drive circuit for piezoelectric transformer. CTS Corporation, Jones Day Reavis & Pogue, January 18, 2000: US06016052 (70 worldwide citation)

A pulse frequency modulation drive circuit (1114) for a piezoelectric transformer (1102) is provided. Circuit (1114) includes a piezoelectric transformer (1102) having a resonant frequency and an input and an output section. A frequency feedback network connected to the piezoelectric transformer (11 ...


7
David L Kordecki: Illuminated controller. CTS Corporation, Michael W Starkweather, Mark P Bourgeois, March 2, 1999: US05876106 (66 worldwide citation)

An illuminated controller having a membrane potentiometer for use as a light dimmer or other voltage controlling device. The controller has a backplate that acts as a sturdy base, and a cover, having sidewalls and a top wall with a central opening. The cover is mounted on the backplate and a layered ...


8
Dale G Hall: Combined piezoelectric silent alarm/battery charger. CTS Corporation, June 26, 2001: US06252336 (66 worldwide citation)

A communication device such as a pager or cellular telephone which requires battery power, uses a piezoelectric device as both a vibrating silent alarm and a battery charger.


9
Ronald L Hinds: Flip chip package for micromachined semiconductors. CTS Corporation, Mark P Bourgeois, Mark W Borgman, May 1, 2001: US06225692 (63 worldwide citation)

A hermetic multilayered ceramic semiconductor package for micromachined semiconductor devices. A low temperature co-fired ceramic assembly has a cavity and a top and bottom surface. Several vias extend between the top and bottom surfaces and several solder spheres are located on the top surface and ...


10
Michael W Starkweather, James Patrick McKenna: Non-contacting throttle valve position sensor. CTS Corporation, Spencer Warnick, Mark P Bourgeois, Mark W Borgman, September 11, 2001: US06288534 (58 worldwide citation)

A throttle valve position sensor in which a non-contacting, magnetic field sensor is coupled to or integral with a gear wheel of a geared throttle valve control. The sensor provides a more durable sensor. Sensor circuitry can be provided on the lid of the control, along with control motor electrical ...