1
Keong Mun Chan, Victor Yue Kwong Lau: Surface mountable light emitting device. Cotco Holdings, Thomas F Lebens, Sinsheimer Schiebelhut & Baggett, October 12, 2004: US06803607 (108 worldwide citation)

This invention relates to a surface mountable light emitting device in which the lead frame is exposed over a substantial portion of the underside of the device so as to allow greater thermal conductivity to any device on which it may be mounted. The LED provides the lens and a molded body to encaps ...


2
Cheng Hsiang Hsu: LED package and the process making the same. Lingsen Precision, Cotco Holdings, Browdy and Neimark, August 3, 2004: US06770498 (84 worldwide citation)

The present invention is to provide a process for fabricating light emitting diode (LED) packages. The process begins with a first step of providing a platelike frame having a plurality of cells, each of which is composed of a main plate and a separate arm. Secondly, an LED die and a reflecting ring ...


3
Wa Hing Leung: Solid state lighting array driving circuit. Cotco Holdings, Jacobson Holman PLLC, March 7, 2006: US07009580 (10 worldwide citation)

A solid-state lighting array driving circuit in which a plurality of solid-state lighting devices such as LEDs are rearranged in a reconfigurable circuit. The circuit may be changed to incorporate the LEDs into a larger or fewer number of parallel circuits each containing less or more LEDs themselve ...


4
Hsu Cheng Hsiang: Led package. Lingsen Prec, Cotco Holdings, November 2, 2005: GB2413698-A (1 worldwide citation)

The process begins with a first step of providing a plate like frame 10 having a plurality of cells 11, each of which is composed of a main plate 16 and a separate arm 19. Secondly, an LED die 20 and a white resin reflecting ring 30 are respectively mounted on a top surface of each main plate such t ...


5
Cheng Siu Cheong, Xie Jian Hui: Apparatus, system and method for use in mounting electronic elements. COTCO HOLDINGS a Hong Kong corporation, Koppel Patrick & Heybl, February 21, 2008: US20080041625-A1

The present embodiments provide apparatuses, systems and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices that comprise a casing comprising a recess formed in the casing and extending into the casing, an insert secured with the casing and extending a ...


6
Wong Xuan, Xie Jian Hui, Cheng Siu Cheong: Apparatus, system and method for use in mounting electronic elements. COTCO HOLDINGS a Hong Kong corporation, Sinsheimer Juhnke Lebens & Mcivor, October 11, 2007: US20070235845-A1

The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a ...


7
Xie Jian Hui, Cheng Siu Cheong: Apparatus and method for use in mounting electronic elements. COTCO HOLDINGS a Hong Kong corporation, Sinsheimer Juhnke Lebens & Mcivor, November 1, 2007: US20070252250-A1

Some embodiments provide surface mount devices that include a first electrode comprising a chip carrier part, a second electrode disposed proximate to the chip carrier part, and a casing encasing a portion of the first and second electrodes. The first electrode can extend from the chip carrier part ...


8
Xuan Wong, Hui Xie Jian, Cheong Cheng Siu: Apparatus, system and method for use in mounting electronic elements. Cotco Holdings A Hong Kong, Chen Wei, June 10, 2009: CN200780019643

The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a ...


9
Shiu Cheng Shiang: Packaged formation method of led and product structure. Lingsen Precision, Cotco Holdings, August 11, 2003: TW546799

The present invention provides a packaged formation method of LED and product structure. The method comprises: first manufacturing a plate-shaped frame by conductive metal, the frame having plural formation areas, each having a master piece and a separation arm; adhering an LED die to the top of eac ...


10
Hsu Cheng Hsiang: Led package forming method using enhanced contact structure between led die and substrate for improving heat radiation and led package structure thereby. Lingsen Precision, Cotco Holdings, February 16, 2006: KR1020040063315

PURPOSE: An LED(Light Emitting Diode) package forming method and an LED package structure thereby are provided to enhance a heat radiation by attaching flatly an LED die on a substrate. CONSTITUTION: A panel type frame(10) is formed by using a metallic material. The panel type frame includes at leas ...