1
Thomas William Kenny Jr, Kenneth E Goodson, Juan G Santiago, George Carl Everett Jr: Power conditioning module. Cooligy, Haverstock & Owens, August 12, 2003: US06606251 (90 worldwide citation)

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module inc ...


2
Peng Zhou, Kenneth Goodson, Juan Suntiago: Vapor escape microchannel heat exchanger. Cooligy, Haverstock & Owens, February 7, 2006: US06994151 (85 worldwide citation)

A vapor escape membrane for use in a heat exchanging device, including a heat pipe or heat sink that runs liquid into a cooling region positioned adjacent to the heat producing device, the vapor escape membrane comprising: a porous surface for removing vapor produced from the liquid in the cooling r ...


3
Kenneth Goodson, Thomas Kenny, Peng Zhou, Girish Upadhya, Mark Munch, Mark McMaster, James Horn: Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device. Cooligy, Haverstock & Owens, September 12, 2006: US07104312 (76 worldwide citation)

A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first ...


4
Thomas W Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, David Corbin: Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device. Cooligy, Haverstock & Owens, January 24, 2006: US06988534 (71 worldwide citation)

A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manif ...


5
Thomas W Kenny, Mark Munch, Peng Zhou, James Gill Shook, Girish Upadhya, Kenneth Goodson, Dave Corbin, Mark McMaster, James Lovette: Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device. Cooligy, Haverstock & Owens, February 21, 2006: US07000684 (63 worldwide citation)

A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. T ...


6
Thomas William Kenny Jr, Kenneth E Goodson, Juan G Santiago, George Carl Everett Jr: Apparatus for conditioning power and managing thermal energy in an electronic device. Cooligy, Haverstock & Owens, June 13, 2006: US07061104 (60 worldwide citation)

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module inc ...


7
Girish Upadhya, Thomas W Kenny, Peng Zhou, Mark Munch, James Gill Shook, Kenneth Goodson, David Corbin: Interwoven manifolds for pressure drop reduction in microchannel heat exchangers. Cooligy, Haverstock & Owens, January 17, 2006: US06986382 (59 worldwide citation)

A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat ...


8
Richard Grant Brewer, Girish Upadhya, Peng Zhou, Mark McMaster, Paul Tsao: Apparatus and method of efficient fluid delivery for cooling a heat producing device. Cooligy, Haverstock & Owens, March 13, 2007: US07188662 (51 worldwide citation)

A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold laye ...


9
James Lovette, Peng Zhou, James Gill Shook: Multi-level microchannel heat exchangers. Cooligy, Haverstock & Owens, January 2, 2007: US07156159 (46 worldwide citation)

An apparatus and method of circulating a heat-absorbing material within a heat exchanger. The apparatus comprises a manifold layer coupled to an interface layer. The manifold layer comprises an inlet manifold and an outlet manifold. The interface layer comprises a plurality of channels that extend f ...


10
Thomas William Kenny Jr, Kenneth E Goodson, Juan G Santiago, John J Kim, Robert C Chaplinsky, George Carl Everett Jr: System including power conditioning modules. Cooligy, Haverstock & Owens, January 13, 2004: US06678168 (40 worldwide citation)

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module inc ...



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