1
Seon Goo Lee: Thin, stackable semiconductor packages. Anam Semiconductor, Amkor Technology, October 16, 2001: US06303997 (369 worldwide citation)

A thin, stackable semiconductor package having improved electrical and heat dissipating performance comprises a semiconductor chip having an integrated circuit and a plurality of input/output pads on a surface thereof. A lead frame having a plurality of inner leads with upper and a lower surfaces ha ...


2
Thomas P Glenn, Steven Webster, Vincent DiCaprio: Chip size semiconductor packages with stacked dies. Amkor Technology, James E Parsons, Bever Hoffman & Harms, June 10, 2003: US06577013 (309 worldwide citation)

Chip-size semiconductor packages (“CSPs”) containing multiple stacked dies are disclosed. The dies are mounted on one another in a stack such that corresponding ones of the vias in the respective dies are coaxially aligned. An electrically conductive wire or pin is in each set of aligned vias and so ...


3
Thomas P Glenn, Scott J Jewler, David Roman, J H Yee, D H Moon: Plastic integrated circuit device package and leadframe having partially undercut leads and die pad. Amkor Technology, Anam Semiconductor, James E Parsons, Skjerven Morrill MacPherson, August 28, 2001: US06281568 (289 worldwide citation)

Packages for an integrated circuit device and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with a stepped profile by an etching step that etches pa ...


4
Thomas P Glenn: Plastic integrated circuit package and method and leadframe for making the package. Amkor Technology, James E Parsons, Skjerven Morrill MacPherson Franklin & Friel, November 7, 2000: US06143981 (274 worldwide citation)

Packages for an integrated circuit die and methods and leadframes for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wires, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the cont ...


5
WonSun Shin, DoSung Chun, SangHo Lee, SeonGoo Lee, Vincent DiCaprio: Semiconductor package and method for fabricating the same. Amkor Technology, May 28, 2002: US06395578 (266 worldwide citation)

Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface an ...


6
David Jon Hiner, Ronald Patrick Huemoeller, Sukianto Rusli: Method of manufacturing a semiconductor package. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, March 6, 2007: US07185426 (258 worldwide citation)

A semiconductor package including top-surface terminals for mounting another semiconductor package provides a three-dimensional circuit configuration that can provide removable connection of existing grid-array packages having a standard design. A semiconductor die is mounted on an electrically conn ...


7
Christopher J Berry, Christopher M Scanlan: Thin stacked interposer package. Amkor Technology, Stetina Brunda Garred & Brucker, August 17, 2010: US07777351 (234 worldwide citation)

The present invention comprises a semiconductor package comprising a bottom semiconductor package substrate which is populated with one or more electronic components. The electronic component(s) of the bottom substrate are covered or encapsulated with a suitable mold compound which hardens into a pa ...


8
Won Sun Shin, Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han: Lead end grid array semiconductor package. Anam Semiconductor, Amkor Technology, Thomas S MacDonald, Skjerven Morrill MacPherson Franklin and Friel, February 2, 1999: US05866939 (225 worldwide citation)

The invention relates to a grid array type lead frame having a plurality of leads classified into groups by length forming a lead end grid array semiconductor package. The leads extend to respective lead ends, in each of which at least one different plane direction-converting lead part and/or at lea ...


9
Vincent DiCaprio, Kenneth Kaskoun: Semiconductor memory cards and method of making same. Amkor Technology, James E Parsons, Bever Hoffman & Harms, September 23, 2003: US06624005 (224 worldwide citation)

Alternative methods for making memory cards for computers and such eliminate a need for a separate external housing and a separate chip encapsulation step and enable more memory to be packaged in a same-sized card. One of said methods includes providing a substrate having opposite first and second s ...


10
Christopher Marc Scanlan, Ronald Patrick Huemoeller: Semiconductor package including a top-surface metal layer for implementing circuit features. Amkor Technology, Gunnison McKay & Hodgson L, Serge J Hodgson, December 15, 2009: US07633765 (220 worldwide citation)

A semiconductor package including a top-surface metal layer for implementing circuit features provides improvements in top-surface interconnect density, more flexible routing and mounting of top surface semiconductor packages, dies and passive components or a conformal shield cap implementation. The ...