1
Masakatsu Suda: Differential signal transmission circuit. Advantest, Muramatsu & Associates, March 27, 2001: US06208161 (155 worldwide citation)

A differential signal transmission circuit for transmitting a high speed pulse signal through relatively long transmission cables. The differential signal transmission circuit includes a CMOS differential driver for receiving a high speed signal to be transmitted from an LSI circuit and providing th ...


2
Rochit Rajsuman, Hiroaki Yamoto: Method and apparatus for SoC design validation. Advantest, Muramatsu & Associates, January 13, 2004: US06678645 (149 worldwide citation)

A method and apparatus for validating SoC (system-on-a-chip) design with high accuracy and speed and low cost. The [apparatus allows to use a] method [which] includes the steps of verifying individual cores to be integrated in an SoC by evaluating a silicon IC having a function a ...


3
Toshiyuki Kiyokawa, Hisao Hayama: IC test equipment. Advantest Corporation, Staas & Halsey, December 15, 1992: US05172049 (126 worldwide citation)

In IC test equipment in which an IC element sucked by an air chuck is carried in the horizontal direction by an X-Y transport unit and the air chuck is lowered toward a test head to load the IC element onto a socket provided on a performance board for test, the socket has a contact housing room defi ...


4
Takashi Watanabe, Minako Yoshida: Method of producing micro contact structure and contact probe using same. Advantest, Muramatsu & Associates, January 16, 2001: US06174744 (118 worldwide citation)

A method of producing a contact structure and a probe card makes it possible to test a semiconductor integrated circuit device formed on a semiconductor wafer having a pin pitch of 0.5 mm or smaller. The contact structure includes a micro contact pin having electric conductivity formed on one end of ...


5
Takenori Kurihara: Variable frequency synthesizer with reduced phase noise. Advantest, Staas & Halsey, July 22, 1986: US04602220 (112 worldwide citation)

A reference signal from a reference signal source is supplied to a frequency transformer and a side band signal generator. The frequency transformer is formed mainly by up-converters and produces a frequency m times as high as the frequency f.sub.s of the reference signal. The side band signal gener ...


6
Tetsuo Sotome, Takayuki Nakajima, Kazutaka Osawa, Kazuhiro Shimawaki, Kouichi Shiroyama: Bit error measurement system. Advantest, Muramatsu & Associates, June 2, 1998: US05761216 (103 worldwide citation)

A bit error measurement system provides means for generating test patterns, multiplexing means and means for specifying and recording a pattern position. In a first aspect, a bit error measurement system has a pattern generator having M channels of pattern generation and a pattern generation control ...


7
Hiroaki Satomura, Shinya Fujita, Junichi Ukita, Katsuhiko Watanabe: Wavelength dispersion probing system. Advantest Corporation, Dellett & Walters, March 28, 2006: US07020360 (94 worldwide citation)

A wavelength dispersion probing system for determining a value of wavelength dispersion and its sign and reducing the trouble and time required for this determination. This wavelength dispersion probing system comprises light sources 10, 12, light attenuators 14, 16, optical multiplexer 18, phase mo ...


8
Masahiro Ishida, Takahiro Yamaguchi, Marco Tilgner: Method and device for compressing and expanding data pattern. Advantest Corporation, David N Lathrop Esq, Gallagher & Lathrop, December 9, 2003: US06661839 (92 worldwide citation)

There are provided methods each of which is for efficiently compressing a test pattern to be applied to an IC for testing. The number of data changes &phgr; and a data entropy H of a pattern for each pin of an IC are obtained and then the test pattern is divided and the divided patterns are distribu ...


9
Theodore A Khoury, James W Frame: Contact structure and production method thereof. Advantest, Muramatsu & Associates, June 26, 2001: US06250933 (89 worldwide citation)

A contact structure for achieving an electrical connection with a contact target is formed of a contact substrate and a plurality of contactors mounted on the contact substrate. The contactors are produced on a semiconductor substrate or other dielectric by a microfabrication technology. Each of the ...


10
Akihiro Fujimoto: Test head cooling system. Advantest, Muramatsu & Associates, June 16, 1998: US05767690 (89 worldwide citation)

The present invention provides a test head cooling system for cooling test heads of a semiconductor IC test apparatus in an enclosed structure. A sealed housing is provided in a test head wherein an air duct is formed in a wall of the sealed box so that cooling air flow effectively. Several thousand ...