WO/2009/142497 is referenced by 5 patents.

The invention is directed to a method of providing a plastic substrate with a metallic pattern and to a plastic substrate with a metallic pattern obtainable by said method. The method of the invention comprises i) replicating a pattern of recesses and protrusions on a plastic substrate by pressing a stamp having recesses and protrusions against the substrate, thereby providing said plastic substrate with recesses and protrusions; ii) removing said stamp from said substrate; iii) -applying a layer of seed material capable of initiating an electroless or electrochemical metal deposition process onto said plastic substrate in a selective pattern at least in the recesses of said plastic substrate to yield a substrate wherein said seed material remains selectively in the recesses of said substrate; and thereafter iv) using said seed material to initiate a metal deposition process.

Title
Providing a plastic substrate with a metallic pattern
Application Number
PCT/NL/2009/050280
Publication Number
2009/142497
Application Date
May 22, 2009
Publication Date
November 26, 2009
Inventor
Tacken Roland Anthony
Furthner Francois
Peter Maria
Meinders Erwin Rinaldo
Agent
Hatzmann Mj
Assignee
Tacken Roland Anthony
Furthner Francois
Peter Maria
Meinders Erwin Rinaldo
Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek Tno
IPC
H05K 03/10
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