WO/2007/102360 is referenced by 79 patents.

(EN) An RFID tag is provided with a dielectric substrate; a grounding conductor section arranged on one main surface of the dielectric substrate; a patch conductor section arranged on the other main surface of the dielectric substrate with a slot formed thereon; an electrically connecting sections extending to the internal from the opposing parts of the slot, respectively; and an IC chip which is arranged inside the slot and is connected to the electrically connecting sections.(JA)  誘電体基板と、この誘電体基板の一主面に設けられた接地導体部と、前記誘電体基板の他の主面に設けられ、スロットを形成したパッチ導体部と、前記スロットの対向部分から内部にそれぞれ延びた電気接続部と、前記スロットの内部に配置され、前記電気接続部に接続されたICチップとを備えたことを特徴とする。

Title
(Ja) rfidタグ、rfidタグの製造方法及びrfidタグの設置方法
(En) Rfid tag, method for manufacturing rfid tag and method for arranging rfid tag
Application Number
PCT/JP2007/053729
Publication Number
2007/102360
Application Date
February 28, 2007
Publication Date
September 13, 2007
Inventor
Kawanami Masashi
Nakatani Takashi
Murakami Osamu
Fukasawa Toru
Nishioka Yasuhiro
Otsuka Masataka
Miyamae Takanori
Okegawa Hirokatsu
Agent
TAZAWA Hiroaki
Assignee
Kawanami Masashi
Nakatani Takashi
Murakami Osamu
Fukasawa Toru
Nishioka Yasuhiro
Otsuka Masataka
Miyamae Takanori
Okegawa Hirokatsu
Mitsubishi Electric Corporation
IPC
H01Q 01/38
H01Q 01/24
G06K 19/077
G06K 19/07
H01Q 13/10
View Original Source