The microcomponent (1) has a first wafer (2), equipped with multiple electrical connection pins (5), a second wafer (7), equipped with multiple electrical connection pads (8), intended to cooperate with the electrical connection pins (5) of the first wafer (2). The second wafer (7) has multiple first interconnection pins (10), formed on the electrical connection pads (8) of the second wafer (7), positioned facing the electrical connection pins (5) of the first wafer (2) and coming into contact with each other by nesting. An interconnection process for the first (2) and second (7) wafers of the microcomponent (1) consisting of at least the stages of the formation of the pins (5) of the first wafer (2), for example by electro-chemical growth, and of the formation of the pins (10) of the second wafer (7), for example by chemical growth.

Title
Microcomponent comprising two wafers interconnected by pins and the associated interconnection process
Application Number
PCT/IB2006/003741
Publication Number
2007/072202
Application Date
December 19, 2006
Publication Date
June 28, 2007
Inventor
Depoutot Frédéric
Roumegoux Julien
Bonvalot Dubois Béatrice
Mathieu Lydie
Pornin Jean Louis
Baleras François
Brun Jean
Agent
AXALTO
Assignee
Depoutot Frédéric
Roumegoux Julien
Bonvalot Dubois Béatrice
Mathieu Lydie
Pornin Jean Louis
Baleras François
Brun Jean
Commissariat A L Energie Atomique
Axalto
IPC
H01L 23/485
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