WO/2007/043639 is referenced by 1 patents.

(EN) A printed wiring board is provided with a base material, which has at least one wiring and is composed of an adhesive insulating base material and a conductive layer formed on one plane of the insulating base material; a penetrating electrode which is connected to the conductive layer, penetrates the insulating base material and is composed of a conductive paste; and an IC chip having a rewiring section. An IC chip is embedded in an interlayer adhesive material of the base material having the wiring, by connecting the rewiring section with the penetrating electrode. A supporting substrate is arranged on a plane opposite to the rewiring section of the IC chip through the adhesive layer, and the rewiring section and the base material having the wiring constitute a rewiring layer. Therefore, the multilayer printed wiring board having fine components mounted thereon is provided by simple process without increasing the cost and deteriorating the yield.(JA)  本発明では、接着性を有する絶縁基材及びこの絶縁基材の一方の面に形成された導電層からなる少なくとも一の配線付き基材と、この導電層に接続され絶縁基材を貫通している導電性ペーストからなる貫通電極と、再配線部を有するICチップとを備え、ICチップが、再配線部を貫通電極に接続させて配線付き基材の層間接着材中に埋め込まれており、ICチップの再配線部の反対側の面に接着層を介して支持基板が配置されており、再配線部と配線付き基材とが再配線層を構成している。  このため、本発明では、容易な工程により作製でき、また、コストの上昇や歩留まりの低下を招来することがなく、高精細な部品を実装した多層のプリント配線基板を提供できる。

Title
(Ja) プリント配線基板及びプリント配線基板の製造方法
(En) Printed wiring board and method for manufacturing printed wiring board
Application Number
PCT/JP2006/320437
Publication Number
2007/043639
Application Date
October 13, 2006
Publication Date
April 19, 2007
Inventor
Okude Satoshi
Suzuki Takanao
Nakao Osamu
Itou Shouji
Okamoto Masahiro
Agent
MIYOSHI Hidekazu
Assignee
Okude Satoshi
Suzuki Takanao
Nakao Osamu
Itou Shouji
Okamoto Masahiro
Fujikura
IPC
H01L 23/12
H05K 03/46
View Original Source