WO/2006/115649 is referenced by 5 patents.

A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension (51) than the first semiconductor chip (40). A spacer (60) is coupled to the second semiconductor chip (50). Bonding pads on the first (40) and second (50) semiconductor chips are wirebonded to bonding pads (18, 19, 20, 21) on the support substrate (12). A third semiconductor chip (80) is mounted to the spacer (60) and bonding pads (86) on the third semiconductor chip (80) are wirebonded to bonding pads (18, 19, 20, 21) on the support substrate (12).

Title
Multi-chip module and method of manufacture
Application Number
PCT/US2006/010547
Publication Number
2006/115649
Application Date
March 24, 2006
Publication Date
November 2, 2006
Inventor
Symmon Bruce E
Du Yong
Yan John
Agent
DRAKE Paul S
Assignee
Symmon Bruce E
Du Yong
Yan John
Spansion
IPC
H01L 25/065
H01L 21/98
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