WO/2006/027732 is referenced by 1 patents.

The invention relates to a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1), to such a reverse mold (2, 4) and to a method for replicating of such a high-density relief structure (1). To provide an improved and reliable method for the best possible replication of a high-density relief structure (1) a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1) is proposed comprising the steps of: applying a curable polymer to a surface of said high-density relief structure (1) having surface shape information to be replicated, thus forming a layer (2) of curable polymer on said surface of said high-density relief structure (1), curing of said polymer to form a reverse mold (2, 4), and separating said reverse mold (2, 4) from said high-density relief structure (1).

Title
Replication of a high-density relief structure
Application Number
PCT/IB2005/052880
Publication Number
2006/027732
Application Date
September 2, 2005
Publication Date
March 16, 2006
Inventor
Meinders Erwin R
Agent
UITTENBOGAARD Frank
Assignee
Meinders Erwin R
Koninklijke Philips Electronics
IPC
G11B 07/26
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