3868724 is referenced by 203 patents and cites 6 patents.

Connecting structures for integrated circuit chips or dice are fabricated by forming a plurality of sets of leads on a first surface of a flexible tape. The sets of leads penetrate through to the second surface of the tape at ends of the leads, via holes formed in the tape. Small contacts are formed to extend beyond the second surface of the tape at the points where the leads penetrate through the tape. The contacts formed at a first end of each of the leads are arranged in a pattern which aligns with corresponding contacts on the integrated circuit chip. The chips are then bonded to the contacts formed at the first ends of the leads, and the chips are subsequently enclosed by a suitable encapsulant such as epoxy. The contacts formed at second ends of the leads are arranged in a pattern which is larger than the pattern of contacts at the first end of the leads, and are disposed for connection to external circuitry.

Title
Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier
Application Number
05/417,999
Publication Number
3868724
Application Date
November 21, 1973
Publication Date
February 25, 1975
Inventor
Perrino Frank A
Agent
Richbourg J Ronald
MacPherson Alan H
Assignee
Fairchild Camera and Instrument Corporation
IPC
H01l 05/00
H01l 03/00
H05K 01/00
H05K 01/11
H01L 23/538
H01L 23/52
H01L 23/48
H01L 23/495
H01L 23/498
H01L 23/28
H01L 23/31
H01L 21/02
H01L 21/60
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