10176832 is referenced by 1 patents and cites 76 patents.

A bond pad set includes at least one ground pad and at least one electrical bond pad configured to bias and send/receive signals. The bond pad set is electrically connected to a multiplicity of electrical components. At least one electrical bond pad of the bond pad set is shared between two or more of the electrical components.

Title
Bond pad sharing for powering a multiplicity of electrical components
Application Number
15/869361
Publication Number
10176832 (B2)
Application Date
January 12, 2018
Publication Date
January 8, 2019
Inventor
Karsten Klarqvist
Roseville
MN, US
Declan Macken
Eden Prairie
MN, US
Jason Bryce Gadbois
Shakopee
MN, US
Agent
Hollingsworth Davis
Assignee
Seagate Technology
CA, US
IPC
G11B 5/00
G11B 5/49
G11B 5/48
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