09812386 cites 334 patents.

An encapsulated semiconductor package. As non-limiting examples, various aspects of the present disclosure provide an integrated circuit package comprising a laminate, an integrated circuit die coupled to the laminate, an encapsulant surrounding at least top and side surface of the integrated circuit die, a conductive column extending from the top side of the integrated circuit die to a top side of the encapsulant, and a signal distribution structure on a top side of the encapsulant.

Title
Encapsulated semiconductor package
Application Number
14/581556
Publication Number
9812386 (B1)
Application Date
December 23, 2014
Publication Date
November 7, 2017
Inventor
David Jon Hiner
Chandler
AZ, US
Sukianto Rusli
Phoenix
AZ, US
Ronald Patrick Huemoeller
Gilbert
AZ, US
Agent
McAndrews Held & Malloy
Assignee
AMKOR TECHNOLOGY
AZ, US
IPC
H01L 23/00
H01L 23/552
H01L 23/31
H01L 23/498
H05K 7/00
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