09804198 cites 22 patents.

An alloy material includes: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, and the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition.

Title
Alloy material, contact probe, and connection terminal
Application Number
14/418964
Publication Number
9804198 (B2)
Application Date
August 2, 2013
Publication Date
October 31, 2017
Inventor
Humio Takahashi
Kanagawa
JP
Noritoshi Takamura
Kanagawa
JP
Tomoyuki Minami
Fukuoka
JP
Kotaro Toyotake
Fukuoka
JP
Tomohiro Kubota
Kochi
JP
Masayuki Ainoya
Kochi
JP
Teruo Anraku
Osaka
JP
Agent
Locke Lord
Assignee
NHK Spring
JP
Shinko Metal Products
JP
Yamamoto Precious Metal
JP
IPC
C12Q 1/00
B01J 2/00
G01R 31/28
G01R 3/00
G01R 1/067
C22C 30/02
C22C 5/04
G01R 1/073
G01R 31/20
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