09647171 is referenced by 4 patents and cites 335 patents.

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.

Title
Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
Application Number
14/479100
Publication Number
9647171 (B2)
Application Date
September 5, 2014
Publication Date
May 9, 2017
Inventor
Rak Hwan Kim
Champaign
IL, US
Sang Il Park
Savoy
IL, US
Eric Brueckner
Champaign
IL, US
Hoon sik Kim
Champaign
IL, US
Ralph Nuzzo
Champaign
IL, US
John A Rogers
Champaign
IL, US
Agent
Lathrop & Gage
Assignee
The Board of Trustees of the University of Illinois
IL, US
IPC
H01L 33/62
H01L 33/54
H01L 33/48
H01L 25/00
H01L 21/683
H01L 23/00
H01L 25/075
H01L 33/00
H01L 33/50
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