09646856 is referenced by 31 patents and cites 20 patents.

A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.

Title
Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip
Application Number
14/715928
Publication Number
9646856 (B2)
Application Date
May 19, 2015
Publication Date
May 9, 2017
Inventor
David O Sullivan
Sinzing
DE
Klaus Reingruber
Beratshausen
DE
Thorsten Meyer
Regensburg
DE
Agent
Eschweiler & Potashnik
Assignee
Intel Deutschland
DE
IPC
H01L 21/78
H01L 21/683
H01L 21/311
H01L 23/00
H01L 23/31
H01L 21/56
H01L 21/304
H01L 21/02
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