09543157 cites 5 patents.

According to various embodiments, a method for processing a carrier may include: performing a dry etch process in a processing chamber to remove a first material from the carrier by an etchant, the processing chamber including an exposed inner surface including aluminum and the etchant including a halogen; and, subsequently, performing a hydrogen plasma process in the processing chamber to remove a second material from at least one of the carrier or the inner surface of the processing chamber.

Title
Method for processing a carrier, a method for operating a plasma processing chamber, and a method for processing a semiconductor wafer
Application Number
14/501055
Publication Number
9543157 (B2)
Application Date
September 30, 2014
Publication Date
January 10, 2017
Inventor
Lothar Brencher
Radeberg
DE
Michael Renner
Moritzburg
DE
Agent
Viering Jentschura & Partner mbB
Assignee
INFINEON TECHNOLOGIES
DE
IPC
H01L 21/3213
H01L 21/02
H01L 21/30
H01L 21/311
H01L 21/3065
C23F 1/00
C03C 25/68
C03C 15/00
B44C 1/22
H01L 21/302
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