09461001 is referenced by 71 patents and cites 8 patents.

The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component, conductive elements, a package body, a shield, a magnetic insulating layer, and a patterned conductive layer. The carrier has a top surface on which the electronic component is disposed. The conductive elements are disposed on the top surface of the carrier. The package body is disposed on the top surface of the carrier and encapsulates the electronic component and a portion of each of the conductive elements. The shield is disposed on the package body and covers an exterior of the package body. The magnetic insulating layer is disposed on a top surface of the shield. The patterned conductive layer is disposed on the magnetic insulating layer. Each of the conductive elements electrically connects the patterned conductive layer to the electronic component.

Title
Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same
Application Number
14/805847
Publication Number
9461001 (B1)
Application Date
July 22, 2015
Publication Date
October 4, 2016
Inventor
Huan Wun Li
Kaohsiung
TW
Chun Chia Lee
Kaohsiung
TW
Wei Yu Chen
Kaohsiung
TW
Ming Horng Tsai
Kaohsiung
TW
Agent
Angela D Murch
Cliff Z Liu
Foley & Lardner
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING
TW
IPC
H02J 7/02
H01L 21/56
H01L 21/48
H01L 23/64
H01L 23/04
H01L 21/768
H01L 21/26
H01L 21/52
H01L 23/538
H01L 23/31
H01L 23/552
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