09353445 cites 10 patents.

Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony telluride are directly bonded to flexible nickel substrates.

Title
Methods for thick films thermoelectric device fabrication
Application Number
14/599227
Publication Number
9353445 (B2)
Application Date
January 16, 2015
Publication Date
May 31, 2016
Inventor
Ronald R Petkie
Fort Collins
CO, US
Agent
Cara Crowley Weber
Paul J Prendergast
Brownstein Hyatt Farber Schreck
Assignee
BERKEN ENERGY
CO, US
IPC
H01L 35/32
H01L 35/18
H01L 35/16
C23C 30/00
H01L 35/34
C23C 28/00
H01L 21/00
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