09017481 is referenced by 119 patents and cites 373 patents.

Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.

Title
Process feed management for semiconductor substrate processing
Application Number
13/284642
Publication Number
9017481 (B1)
Application Date
October 28, 2011
Publication Date
April 28, 2015
Inventor
Mike Halpin
Scottsdale
AZ, US
Kyle Fondurulia
Phoenix
AZ, US
Todd Dunn
Cave Creek
AZ, US
Eric Shero
Phoenix
AZ, US
Sokol Ibrani
Scottsdale
AZ, US
Dave Marquardt
Scottsdale
AZ, US
Carl White
Gilbert
AZ, US
Fred Pettinger
Phoenix
AZ, US
Agent
Snell & Wilmer
Assignee
ASM America
AZ, US
IPC
H01J 37/32
C23C 16/44
C23C 16/455
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