08988093 is referenced by 29 patents and cites 376 patents.

A probe assembly that acts as a temporary interconnect between terminals on an IC device and a test station. The probe assembly includes a plurality of stud bumps arranged on a first surface of a substrate in a configuration corresponding to the terminal on the IC device. The stud bumps include a shape adapted to temporarily couple with the terminals on the IC device. A plurality of conductive traces on the substrate electrically couple the stud bumps with the test station.

Title
Bumped semiconductor wafer or die level electrical interconnect
Application Number
13/413032
Publication Number
8988093 (B2)
Application Date
March 6, 2012
Publication Date
March 24, 2015
Inventor
James Rathburn
Maple Grove
MN, US
Agent
Stoel Rives
Assignee
Hsio Technologies
MN, US
IPC
G01R 31/28
G01R 1/067
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