08987886 is referenced by 29 patents and cites 326 patents.

An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses. A conductive material is deposited in a plurality of the first recesses to form a plurality of first conductive pillars electrically coupled to, and extending generally perpendicular to, the first circuitry layer. At least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars. A conductive material is deposited in a plurality of the second recesses to form a plurality of second conductive pillars electrically coupled to, and extending parallel the first conductive pillars.

Title
Copper pillar full metal via electrical circuit structure
Application Number
13/413724
Publication Number
8987886 (B2)
Application Date
March 7, 2012
Publication Date
March 24, 2015
Inventor
James Rathburn
Mound
MN, US
Agent
Stoel Rives
Assignee
HSIO Technologies
MN, US
IPC
H01L 21/768
H01L 21/48
H01L 23/498
H01L 23/52
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