08969132 is referenced by 2 patents and cites 21 patents.

Disclosed and claimed herein is a microwave assembly having a substrate comprising a microwave device; said device having a die, a first layer having a dielectric constant between about 1.00 and about 1.45 and a thickness between about 0.05 and about 2 mm along with one or more layers chosen from an absorbing layer, an EMI blocking layer, a layer comprising conductive material or a metal cover.

Title
Device package and methods for the fabrication thereof
Application Number
13/237931
Publication Number
8969132 (B2)
Application Date
September 20, 2011
Publication Date
March 3, 2015
Inventor
James MacDonald
Chandler
AZ, US
David William Sherrer
Radford
VA, US
Agent
Dann Dorfman Herrell & Skillman PC
Niels Haun
Assignee
Nuvotronics
VA, US
IPC
H01Q 23/00
H01Q 17/00
H01L 23/00
H01L 23/24
H01L 23/06
C23C 28/00
C23C 28/04
C23C 24/08
H01L 23/047
H01L 21/00
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