08966427 cites 30 patents.

Methods and systems for improving the reliability of C4 solder ball contacts performed at the design stage to reduce the incidence of thermally-induced failures, including those due to electromigration and thermal cycling.

Title
Systems and methods for integrated circuit C4 ball placement
Application Number
14/104447
Publication Number
8966427 (B2)
Application Date
December 12, 2013
Publication Date
February 24, 2015
Inventor
Sheldon Logan
Santa Cruz
CA, US
Matthew Guthaus
Santa Cruz
CA, US
Agent
Matthew Rupert Kaser
Adam W Bell
Assignee
The Regents of the University of California
CA, US
IPC
G06F 17/50
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