08956905 is referenced by 1 patents and cites 6 patents.

Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony are directly bonded to flexible nickel substrates.

Title
Methods for thick films thermoelectric device fabrication
Application Number
14/170544
Publication Number
8956905 (B2)
Application Date
January 31, 2014
Publication Date
February 17, 2015
Inventor
Ronald R Petkie
Fort Collins
CO, US
Agent
Cara L Crowley Weber
Brownstein Hyatt Farber Schreck
Assignee
Berken Energy
CO, US
IPC
H01L 35/34
H01L 21/00
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