08955215 is referenced by 29 patents and cites 377 patents.

A method of forming an interconnect assembly including forming a substrate with a plurality of through holes extending from a first major surface to a second major surface. A plurality of recesses are formed in the second major surface of the substrate that at least partially overlap with the plurality of through holes. The recesses have a cross-sectional area greater than a cross-sectional area of the through holes. At least one discrete contact member is inserted in a plurality of the through holes. The contact members include proximal ends extending into the recesses, distal ends extending above the first major surface, and intermediate portions engaged with an engagement region of the substrate located between the first major surface and the recesses. Retention members at least partially deposited in the recesses bond to the proximal ends to retain the contact members in the through holes.

Title
High performance surface mount electrical interconnect
Application Number
13/266486
Publication Number
8955215 (B2)
Application Date
May 25, 2010
Publication Date
February 17, 2015
Inventor
James Rathburn
Mound
MN, US
Agent
Stoel Rives
Assignee
Hsio Technologies
MN, US
IPC
H01R 12/70
H01R 12/57
H05K 1/00
H01K 3/10
H05K 3/30
H05K 3/34
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